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Manufacturer:
Amphenol ICC (FCI)Description:
CONN IC DIP SOCKET 18POS TINLEAD
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Attributes
Technical Documents
| TYPE | DESCRIPTION |
|---|---|
| Manufacturer | Amphenol ICC (FCI) |
| Series | DILB |
| Features | Open Frame |
| Mounting Type | Through Hole |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Operating Temperature | -55°C ~ 125°C |
| Number of Positions or Pins (Grid) | 18 (2 x 9) |
| Termination | Solder |
| Housing Material | Polyamide (PA), Nylon |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin-Lead |
| Contact Finish Thickness - Mating | 100.0µin (2.54µm) |
| Contact Material - Mating | Copper Alloy |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) |
| Contact Material - Post | Copper Alloy |
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DILB18P-223TLF - From Manufacturer: Amphenol Communications Solutions, it is an CONN IC DIP SOCKET 18POS TINLEAD, part of Connectors, Interconnects, Sockets for ICs, Transistors, IC Sockets. DILB18P-223TLF stock status: In stock; order now! Ships immediately.
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