ICO Series, IC Sockets

Results:
456
Manufacturer
Series
Number of Positions or Pins (Grid)
Operating Temperature
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Type
Contact Finish - Mating
Contact Material - Post
Contact Finish - Post
Contact Material - Mating
Housing Material
Termination
Mounting Type
Pitch - Post
Features
Pitch - Mating
Results remaining456
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ICO
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
ICO-314-SST-L
CONN IC DIP SOCKET 14POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
14 (2 x 7)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
-
Brass
ICO-316-M-TT
CONN IC DIP SOCKET 16POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
16 (2 x 8)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Brass
ICO-143-S8-T
CONN IC DIP SOCKET 14POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
14 (2 x 7)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-203-S8-T
CONN IC DIP SOCKET 20POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
20 (2 x 10)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-286-S8-T
CONN IC DIP SOCKET 28POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
28 (2 x 14)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-326-S8A-T
CONN IC DIP SOCKET 32POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
32 (2 x 16)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-326-S8-T
CONN IC DIP SOCKET 32POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
32 (2 x 16)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-406-S8A-T
CONN IC DIP SOCKET 40POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
40 (2 x 20)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-486-S8A-T
CONN IC DIP SOCKET 48POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
48 (2 x 24)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-486-S8-T
CONN IC DIP SOCKET 48POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
48 (2 x 24)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-083-S8-T
CONN IC DIP SOCKET 8POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
8 (2 x 4)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-163-S8A-T
CONN IC DIP SOCKET 16POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
16 (2 x 8)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-183-S8A-T
CONN IC DIP SOCKET 18POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
18 (2 x 9)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-203-S8A-T
CONN IC DIP SOCKET 20POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
20 (2 x 10)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-243-S8A-T
CONN IC DIP SOCKET 24POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
24 (2 x 12)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-246-S8-T
CONN IC DIP SOCKET 24POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
24 (2 x 12)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-286-S8A-T
CONN IC DIP SOCKET 28POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
28 (2 x 14)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-406-S8-T
CONN IC DIP SOCKET 40POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
40 (2 x 20)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-426-S8-T
CONN IC DIP SOCKET 42POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-65°C ~ 105°C
42 (2 x 21)
Polyester, Glass Filled
ICO
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
ICO-314-M-TT
CONN IC DIP SOCKET 14POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
14 (2 x 7)
Polyester, Glass Filled
ICO
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.