BU-178HT Series, IC Sockets

Results:
12
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining12
Applied Filters:
BU-178HT
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypePitch - MatingContact Finish - MatingTerminationPitch - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish - PostContact Finish Thickness - PostContact Material - Post
BU060Z-178-HT
CONN IC DIP SOCKET 6POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
6 (2 x 3)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU200Z-178-HT
CONN IC DIP SOCKET 20POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
20 (2 x 10)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU240Z-178-HT
CONN IC DIP SOCKET 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.6" (15.24mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU480Z-178-HT
CONN IC DIP SOCKET 48POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
48 (2 x 24)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.6" (15.24mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU160Z-178-HT
CONN IC DIP SOCKET 16POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU180Z-178-HT
CONN IC DIP SOCKET 18POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
18 (2 x 9)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU400Z-178-HT
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
40 (2 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.6" (15.24mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU640Z-178-HT
CONN IC DIP SOCKET 64POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
64 (2 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.9" (22.86mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU14OZ-178-HT
CONN IC DIP SOCKET 14POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
14 (2 x 7)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU080Z-178-HT
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU220Z-178-HT
CONN IC DIP SOCKET 22POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
22 (2 x 11)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.4" (10.16mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU280Z-178-HT
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.6" (15.24mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.