110 Series, IC Sockets

Results:
1,153
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Type
Contact Finish - Mating
Housing Material
Contact Finish Thickness - Post
Contact Finish - Post
Features
Contact Material - Post
Mounting Type
Operating Temperature
Termination
Pitch - Post
Contact Material - Mating
Pitch - Mating
Results remaining1,153
Applied Filters:
110
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
110-87-314-41-001101
CONN IC DIP SOCKET 14POS GOLD
1+
$2.5352
5+
$2.3944
10+
$2.2535
Quantity
4,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
14 (2 x 7)
110
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-001101
CONN IC DIP SOCKET 32POS GOLD
1+
$3.9803
5+
$3.7592
10+
$3.5380
Quantity
661 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
32 (2 x 16)
110
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-001101
CONN IC DIP SOCKET 20POS GOLD
1+
$0.5070
5+
$0.4789
10+
$0.4507
Quantity
500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
20 (2 x 10)
110
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-324-41-001101
CONN IC DIP SOCKET 24POS GOLD
1+
$0.8873
5+
$0.8380
10+
$0.7887
Quantity
500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
24 (2 x 12)
110
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-640-41-001101
CONN IC DIP SOCKET 40POS GOLD
1+
$2.7127
5+
$2.5620
10+
$2.4113
Quantity
300 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
40 (2 x 20)
110
DIP, 0.6" (15.24mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-001101
CONN IC DIP SOCKET 18POS GOLD
1+
$1.2397
5+
$1.1708
10+
$1.1020
Quantity
198 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
18 (2 x 9)
110
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-308-41-001101
CONN IC DIP SOCKET 8POS GOLD
1+
$0.5070
5+
$0.4789
10+
$0.4507
Quantity
27 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
8 (2 x 4)
110
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-001101
CONN IC DIP SOCKET 16POS GOLD
1+
$2.0282
5+
$1.9155
10+
$1.8028
Quantity
25 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
16 (2 x 8)
110
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-308-41-001101
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
8 (2 x 4)
110
DIP, 0.3" (7.62mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-420-41-001101
CONN IC DIP SOCKET 20POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
20 (2 x 10)
110
DIP, 0.4" (10.16mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-632-41-605101
CONN IC DIP SOCKET 32POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
32 (2 x 16)
110
DIP, 0.6" (15.24mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-43-316-61-105000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
16 (2 x 8)
110
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-316-61-105000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
16 (2 x 8)
110
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-210-61-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
10 (2 x 5)
110
DIP, 0.2" (5.08mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-308-61-105000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
8 (2 x 4)
110
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-306-61-105000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
6 (2 x 3)
110
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-632-61-801000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (2 x 16)
110
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame, Decoupling Capacitor
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-308-61-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
8 (2 x 4)
110
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
-
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-308-61-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
8 (2 x 4)
110
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
-
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-642-41-105000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
42 (2 x 21)
110
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.