0517 Series, IC Sockets

Results:
25
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Type
Contact Finish - Post
Contact Material - Mating
Pitch - Mating
Features
Results remaining25
Applied Filters:
0517
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesOperating TemperaturePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostHousing MaterialMounting TypeNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingContact Finish Thickness - PostContact Material - Post
02-0517-90C
CONN SOCKET SIP 2POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
2 (1 x 2)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
21-0517-90C
CONN SOCKET SIP 21POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
21 (1 x 21)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
23-0517-90C
CONN SOCKET SIP 23POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
23 (1 x 23)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
01-0517-90C
CONN SOCKET SIP 1POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
1 (1 x 1)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
13-0517-90C
CONN SOCKET SIP 13POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
13 (1 x 13)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
16-0517-90C
CONN SOCKET SIP 16POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
16 (1 x 16)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
18-0517-90C
CONN SOCKET SIP 18POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
18 (1 x 18)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
19-0517-90C
CONN SOCKET SIP 19POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
19 (1 x 19)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
07-0517-90C
CONN SOCKET SIP 7POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
7 (1 x 7)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
09-0517-90C
CONN SOCKET SIP 9POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
9 (1 x 9)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
10-0517-90C
CONN SOCKET SIP 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
10 (1 x 10)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
11-0517-90C
CONN SOCKET SIP 11POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
11 (1 x 11)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
12-0517-90C
CONN SOCKET SIP 12POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
12 (1 x 12)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
17-0517-90C
CONN SOCKET SIP 17POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
17 (1 x 17)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
20-0517-90C
CONN SOCKET SIP 20POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
20 (1 x 20)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
22-0517-90C
CONN SOCKET SIP 22POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
22 (1 x 22)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
24-0517-90C
CONN SOCKET SIP 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
24 (1 x 24)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
04-0517-90C
CONN SOCKET SIP 4POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
4 (1 x 4)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
06-0517-90C
CONN SOCKET SIP 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
6 (1 x 6)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
08-0517-90C
CONN SOCKET SIP 8POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle
8 (1 x 8)
0517
SIP
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.