ED Series, IC Sockets

Results:
26
Manufacturer
Series
Number of Positions or Pins (Grid)
Housing Material
Type
Contact Finish - Mating
Operating Temperature
Contact Finish Thickness - Mating
Mounting Type
Pitch - Post
Contact Finish Thickness - Post
Contact Finish - Post
Features
Pitch - Mating
Contact Material - Post
Termination
Contact Material - Mating
Results remaining26
Applied Filters:
ED
Select
ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialOperating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
ED28DT
CONN IC DIP SOCKET 28POS TIN
1+
$0.5045
5+
$0.4765
10+
$0.4485
Quantity
4,238 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.6" (15.24mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED18DT
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
18 (2 x 9)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED16DT
CONN IC DIP SOCKET 16POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED24DT
CONN IC DIP SOCKET 24POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.6" (15.24mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED281DT
CONN IC DIP SOCKET 28POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED14DT
CONN IC DIP SOCKET 14POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (2 x 7)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED08DT
CONN IC DIP SOCKET 8POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED20DT
CONN IC DIP SOCKET 20POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (2 x 10)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED020PLCZ-SM-N
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
-
20 (4 x 5)
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
ED052PLCZ-SM-N
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
-
52 (2 x 26)
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
ED032PLCZ
CONN SOCKET PLCC 32POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (2 x 16)
Polybutylene Terephthalate (PBT)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
ED068PLCZ
CONN SOCKET PLCC 68POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
68 (2 x 34)
Polybutylene Terephthalate (PBT)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
ED241DT
CONN IC DIP SOCKET 24POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED068PLCZ-SM-N
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
-
68 (2 x 34)
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
ED40DT
CONN IC DIP SOCKET 40POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
40 (2 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.6" (15.24mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED084PLCZ-SM-N
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
-
84 (2x42)
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
ED06DT
CONN IC DIP SOCKET 6POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
6 (2 x 3)
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
ED044PLCZ-SM-N
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
-
44 (2 x 22)
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
ED028PLCZ-SM-N
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
-
28 (2 x 14)
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
ED044PLCZ
CONN SOCKET PLCC 44POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
44 (2 x 22)
Polybutylene Terephthalate (PBT)
-55°C ~ 105°C
ED
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.