8080 Series, IC Sockets

Results:
22
Manufacturer
Series
Contact Finish - Mating
Housing Material
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Finish Thickness - Post
Mounting Type
Number of Positions or Pins (Grid)
Operating Temperature
Contact Material - Post
Termination
Pitch - Post
Type
Features
Contact Material - Mating
Pitch - Mating
Results remaining22
Applied Filters:
8080
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypePitch - MatingContact Finish - MatingTerminationPitch - PostOperating TemperatureSeriesTypeNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing Material
6-6437504-2
CONN TRANSIST TO-3 3POS SILVER
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Silver
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
-
Beryllium Copper
Closed Frame
Silver
-
Beryllium Copper
Diallyl Phthalate (DAP)
8080-1G2-LF
CONN TRANSIST TO-3 3POS SILVER
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Silver
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
-
Beryllium Copper
Closed Frame
Silver
-
Beryllium Copper
Polytetrafluoroethylene (PTFE)
9-1437504-3
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8-1437504-3
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8-1437504-2
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8-1437504-0
CONN TRANSIST TO-3 3POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Gold
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Gold
30.0µin (0.76µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8-1437504-1
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
-
Beryllium Copper
Closed Frame
Tin
-
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8080-1G3-LF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8080-1G9
CONN TRANSIST TO-3 4POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-
Gold
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
4 (Round)
-
Beryllium Copper
Closed Frame
Gold
-
Beryllium Copper
Fluoropolymer (FP)
9-1437504-0
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8-1437504-5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
-
Beryllium Copper
Closed Frame
Tin
-
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8080-1G1-LF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8080-1G15
CONN TRANSIST TO-3 3POS TIN-LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Tin-Lead
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
Tin-Lead
200.0µin (5.08µm)
Beryllium Copper
Fluoropolymer (FP)
5-6437504-0
CONN TRANSIST TO-3 3POS SILVER
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Silver
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
-
Beryllium Copper
Closed Frame
Silver
-
Beryllium Copper
Diallyl Phthalate (DAP)
8080-1G14
CONN SOCKET TRANSIST TO-3 3POS
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-
Tin-Lead
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
Tin-Lead
-
Beryllium Copper
Phenolic
8080-1G16-LF
CONN TRANSIST TO-3 3POS SILVER
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Quantity
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Silver
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
-
Beryllium Copper
Closed Frame
Silver
-
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8080-1G7
CONN TRANSIST TO-3 4POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-
Gold
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
4 (Round)
-
Beryllium Copper
Closed Frame
Gold
-
Beryllium Copper
Fluoropolymer (FP)
9-1437504-1
CONN TRANSIST TO-3 3POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
Gold
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Gold
30.0µin (0.76µm)
Beryllium Copper
Polytetrafluoroethylene (PTFE)
8080-1G10
CONN SOCKET TRANSIST TO-3 3POS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-
Gold
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
3 (Oval)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Gold
-
Beryllium Copper
Diallyl Phthalate (DAP)
8080-1G1
CONN TRANSIST TO-3 4POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-
Tin-Lead
Solder
-
-55°C ~ 125°C
8080
Transistor, TO-3
4 (Round)
-
Beryllium Copper
Closed Frame
Tin-Lead
-
Beryllium Copper
Fluoropolymer (FP)

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.