PRS Series, IC Sockets

Results:
133
Manufacturer
Series
Operating Temperature
Number of Positions or Pins (Grid)
Contact Finish Thickness - Post
Contact Finish - Post
Contact Finish - Mating
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Pitch - Post
Type
Features
Contact Material - Mating
Pitch - Mating
Results remaining133
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostHousing MaterialNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish - PostContact Finish Thickness - PostContact Material - Post
169-PRS13001-16
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
114-PRS13021-16
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
196-PRS14001-16
CONN SOCKET PGA ZIF GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
20-PRS13120-12
CONN SOCKET PGA ZIF GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
144-PRS15026-16
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
34-PRS17034-16
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
441-PRS21001-16
CONN SOCKET PGA ZIF GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
68-PRS11033-16
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
84-PRS11032-16
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
179-PRS18038-12
CONN SOCKET PGA ZIF GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
180-PRS18007-12
CONN SOCKET PGA ZIF GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
181-PRS18041-12
CONN SOCKET PGA ZIF GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
280-PRS19006-12
CONN SOCKET PGA ZIF GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
256-PRS16001-12
CONN SOCKET PGA ZIF GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
281-PRS19012-12
CONN SOCKET PGA ZIF GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
281-PRS18037-12
CONN SOCKET PGA ZIF GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
240-PRS20014-12
CONN SOCKET PGA ZIF GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
256-PRS20005-12
CONN SOCKET PGA ZIF GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
257-PRS20012-12
CONN SOCKET PGA ZIF GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper
162-PRS20020-12
CONN SOCKET PGA ZIF GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 125°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Tin
200.0µin (5.08µm)
Beryllium Copper

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.