614 Series, IC Sockets

Results:
1,410
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Contact Material - Post
Contact Finish - Mating
Operating Temperature
Housing Material
Features
Termination
Mounting Type
Pitch - Post
Contact Material - Mating
Pitch - Mating
Results remaining1,410
Applied Filters:
614
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
614-43-950-31-002000
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
50 (2 x 25)
614
DIP, 0.9" (22.86mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-179-18-111112
CONN SOCKET PGA 179POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
179 (18 x 18)
614
PGA
Flash
Beryllium Copper
Carrier, Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-43-642-41-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
42 (2 x 21)
614
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-632-31-002000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
32 (2 x 16)
614
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-964-31-018000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
64 (2 x 32)
614
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-648-31-012000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
48 (2 x 24)
614
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-296-19-131144
CONN SOCKET PGA 296POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
296 (19 x 19)
614
PGA
Flash
Beryllium Copper
Carrier, Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-632-31-018000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
32 (2 x 16)
614
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-632-31-018000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
32 (2 x 16)
614
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-640-31-002000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
40 (2 x 20)
614
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-325-18-111144
CONN SOCKET PGA 325POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
325 (18 x 18)
614
PGA
Flash
Beryllium Copper
Carrier, Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-321-19-121144
CONN SOCKET PGA 321POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
321 (19 x 19)
614
PGA
Flash
Beryllium Copper
Carrier, Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-91-964-41-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
64 (2 x 32)
614
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-328-41-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
28 (2 x 14)
614
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-628-41-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
28 (2 x 14)
614
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-652-31-002000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
52 (2 x 26)
614
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-181-15-051112
CONN SOCKET PGA 181POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
181 (15 x 15)
614
PGA
Flash
Beryllium Copper
Carrier, Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-91-952-41-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
52 (2 x 26)
614
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-950-31-002000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
50 (2 x 25)
614
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-964-41-001000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
64 (2 x 32)
614
DIP, 0.9" (22.86mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.