Vertisockets™ 800 Series, IC Sockets

Results:
288
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Type
Operating Temperature
Contact Finish Thickness - Post
Contact Finish - Post
Contact Finish - Mating
Contact Material - Post
Housing Material
Mounting Type
Contact Material - Mating
Termination
Pitch - Post
Features
Pitch - Mating
Results remaining288
Applied Filters:
Vertisockets™ 800
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialMounting TypeSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
16-810-90T
CONN IC DIP SOCKET 16POS TIN
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Vertical
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
12-810-90C
CONN IC DIP SOCKET 12POS GOLD
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
12 (2 x 6)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Vertical
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
08-822-90E
CONN IC DIP SOCKET 8POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
8 (2 x 4)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
50.0µin (1.27µm)
Phosphor Bronze
Closed Frame
50.0µin (1.27µm)
Phosphor Bronze
14-810-90C
CONN IC DIP SOCKET 14POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
14 (2 x 7)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Vertical
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
14-810-90R
CONN IC DIP SOCKET 14POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
14 (2 x 7)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Vertical
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
50.0µin (1.27µm)
Phosphor Bronze
Closed Frame
50.0µin (1.27µm)
Phosphor Bronze
10-2810-90T
CONN IC DIP SOCKET 10POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
10 (2 x 5)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Vertical
Vertisockets™ 800
DIP, 0.2" (5.08mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
14-810-90T
CONN IC DIP SOCKET 14POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
14 (2 x 7)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Vertical
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
10-822-90C
CONN IC DIP SOCKET 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
10 (2 x 5)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
10-820-90C
CONN IC DIP SOCKET 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
10 (2 x 5)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
16-822-90E
16 PIN RT ANGLE HORIZONTAL SOCKT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
105°C
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
50.0µin (1.27µm)
Phosphor Bronze
Closed Frame
50.0µin (1.27µm)
Phosphor Bronze
10-2820-90T
CONN IC DIP SOCKET 10POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
10 (2 x 5)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.2" (5.08mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
08-6820-90C
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
8 (2 x 4)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
06-6820-90C
CONN IC DIP SOCKET 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
6 (2 x 3)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
06-6823-90C
CONN IC DIP SOCKET 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
6 (2 x 3)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
08-822-90C
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
8 (2 x 4)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
06-823-90C
CONN IC DIP SOCKET 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
6 (2 x 3)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
04-822-90C
CONN IC DIP SOCKET 4POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
4 (2 x 2)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
04-820-90C
CONN IC DIP SOCKET 4POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 105°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
4 (2 x 2)
Polyamide (PA46), Nylon 4/6, Glass Filled
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
08-2820-90T
CONN IC DIP SOCKET 8POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
8 (2 x 4)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.2" (5.08mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
40-6823-90
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
40 (2 x 20)
Polyamide (PA46), Nylon 4/6
Through Hole, Right Angle, Horizontal
Vertisockets™ 800
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.