8400 Series, IC Sockets

Results:
27
Manufacturer
Series
Number of Positions or Pins (Grid)
Mounting Type
Pitch - Post
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Contact Finish Thickness - Post
Type
Contact Finish - Post
Contact Material - Mating
Features
Pitch - Mating
Results remaining27
Applied Filters:
8400
Select
ImageProduct DetailPriceAvailabilityECAD ModelMounting TypePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostSeriesOperating TemperatureHousing MaterialTypeNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
8444-21B1-RK-TP
CONN SOCKET PLCC 44POS TIN
1+
$2.5352
5+
$2.3944
10+
$2.2535
Quantity
52 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
44 (4 x 11)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8428-11B1-RK-TP
CONN SOCKET PLCC 28POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
28 (4 x 7)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8432-21A1-RK-TP
CONN SOCKET PLCC 32POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
32 (2 x 7, 2 x 9)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8452-11B1-RK-TP
CONN SOCKET PLCC 52POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
52 (4 x 13)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8452-21A1-RK-TP
CONN SOCKET PLCC 52POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
52 (4 x 13)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8432-11B1-RK-TP
CONN SOCKET PLCC 32POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
32 (2 x 7, 2 x 9)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8428-21B1-RK-TP
CONN SOCKET PLCC 28POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
28 (4 x 7)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8484-11B1-RK-TP
CONN SOCKET PLCC 84POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
84 (4 x 21)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8468-11B1-RK-TP
CONN SOCKET PLCC 68POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
68 (4 x 17)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8468-21B1-RK-TR
CONN SOCKET PLCC 68POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
68 (4 x 17)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8444-21A1-RK-TP
CONN SOCKET PLCC 44POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
44 (4 x 11)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8432-21B1-RK-TR
CONN SOCKET PLCC 32POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
32 (2 x 7, 2 x 9)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8420-21B1-RK-TP
CONN SOCKET PLCC 20POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
20 (4 x 5)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8420-11B1-RK-TP
CONN SOCKET PLCC 20POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
20 (4 x 5)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8428-21B1-RK-TR
CONN SOCKET PLCC 28POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
28 (4 x 7)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8420-21B1-RK-TR
CONN SOCKET PLCC 20POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
20 (4 x 5)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8420-21A1-RK-TP
CONN SOCKET PLCC 20POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
20 (4 x 5)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8452-21B1-RK-TP
CONN SOCKET PLCC 52POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
52 (4 x 13)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8444-11B1-RK-TP
CONN SOCKET PLCC 44POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
44 (4 x 11)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
8444-21B1-RK-TR
CONN SOCKET PLCC 44POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
8400
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
PLCC
44 (4 x 11)
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.