SA Series, IC Sockets

Results:
27
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Pitch - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining27
Applied Filters:
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureSeriesNumber of Positions or Pins (Grid)TypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
SA649040
CONN IC DIP SOCKET 64POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-40°C ~ 105°C
SA
64 (2 x 32)
DIP, 0.9" (22.86mm) Row Spacing
Flash
Beryllium Copper
Open Frame
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA649000
CONN IC DIP SOCKET 64POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
64 (2 x 32)
DIP, 0.9" (22.86mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA406000
CONN IC DIP SOCKET 40POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
40 (2 x 20)
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA283000
CONN IC DIP SOCKET 28POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
28 (2 x 14)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA246000
CONN IC DIP SOCKET 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
24 (2 x 12)
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA243000
CONN IC DIP SOCKET 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
24 (2 x 12)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA286000
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
28 (2 x 14)
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA163040
CONN IC DIP SOCKET 16POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-40°C ~ 105°C
SA
16 (2 x 8)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA183040
CONN IC DIP SOCKET 18POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-40°C ~ 105°C
SA
18 (2 x 9)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA203040
CONN IC DIP SOCKET 20POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-40°C ~ 105°C
SA
20 (2 x 10)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA103000
CONN IC DIP SOCKET 10POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
10 (2 x 5)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA143000
CONN IC DIP SOCKET 14POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
14 (2 x 7)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA243040
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-40°C ~ 105°C
SA
24 (2 x 12)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA486000
CONN IC DIP SOCKET 48POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
48 (2 x 24)
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA163000
CONN IC DIP SOCKET 16POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
16 (2 x 8)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA183000
CONN IC DIP SOCKET 18POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
18 (2 x 9)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA203000
CONN IC DIP SOCKET 20POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
SA
20 (2 x 10)
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA246040
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-40°C ~ 105°C
SA
24 (2 x 12)
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA406040
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-40°C ~ 105°C
SA
40 (2 x 20)
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
SA286040
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-40°C ~ 105°C
SA
28 (2 x 14)
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.