523 Series, IC Sockets

Results:
744
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Post
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Features
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Contact Material - Mating
Housing Material
Termination
Mounting Type
Pitch - Post
Type
Pitch - Mating
Results remaining744
Applied Filters:
523
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostSeriesTypeNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingContact Finish Thickness - PostContact Material - PostHousing Material
523-93-084-10-031001
PGA SOCK 84PIN 10X10 WIRE WRAP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
84 (10 x 10)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-323-21-005003
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
323 (21 x 21)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-323-21-005001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
323 (21 x 21)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-299-20-096001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
299 (20 x 20)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-289-17-000001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
289 (17 x 17)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-281-19-081001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
281 (19 x 19)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-256-16-000003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
256 (16 x 16)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-241-18-075003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
241 (18 x 18)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-241-18-075001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
241 (18 x 18)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-13-132-13-041001
PGA SOCKET 13X13 132 PINS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
523
PGA
132 (13 x 13)
30.0µin (0.76µm)
-
10.0µin (0.25µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-289-17-000003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
289 (17 x 17)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-101-13-061001
PGA SOCK 101PIN 13X13 WIRE WRAP
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
101 (13 x 13)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-169-17-101002
PGA SOCK 169 PIN 17X17 WIRE WD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
169 (17 x 17)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-168-17-101002
PGA SOCK 168 PIN 17X17 WIRE WD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
168 (17 x 17)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-441-21-000001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
441 (21 x 21)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-400-20-000001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
400 (20 x 20)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-361-19-000002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
361 (19 x 19)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-323-21-005003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
323 (21 x 21)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-323-21-005001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
323 (21 x 21)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-299-20-096002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin-Lead
523
PGA
299 (20 x 20)
30.0µin (0.76µm)
-
200.0µin (5.08µm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.