D01-950 Series, IC Sockets

Results:
14
Manufacturer
Series
Number of Positions or Pins (Grid)
Housing Material
Contact Finish Thickness - Mating
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Termination
Mounting Type
Pitch - Post
Contact Finish Thickness - Post
Type
Contact Finish - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining14
Applied Filters:
D01-950
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
D01-9500442
CONN SOCKET SIP 4POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
4 (1 x 4)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9500542
CONN SOCKET SIP 5POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
5 (1 x 5)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9500642
CONN SOCKET SIP 6POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
6 (1 x 6)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9500742
CONN SOCKET SIP 7POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
7 (1 x 7)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9500842
CONN SOCKET SIP 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
8 (1 x 8)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9500942
CONN SOCKET SIP 9POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
9 (1 x 9)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9501042
CONN SOCKET SIP 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
10 (1 x 10)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9501242
CONN SOCKET SIP 12POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
12 (1 x 12)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9501442
CONN SOCKET SIP 14POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
14 (1 x 14)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9501642
CONN SOCKET SIP 16POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
16 (1 x 16)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9501842
CONN SOCKET SIP 18POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
18 (1 x 18)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9502042
CONN SOCKET SIP 20POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
20 (1 x 20)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9503242
CONN SOCKET SIP 32POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
32 (1 x 32)
D01-950
SIP
29.5µin (0.75µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9506442
CONN SOCKET SIP 46POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
46 (1 x 46)
D01-950
SIP
30.0µin (0.76µm)
Beryllium Copper
Elevated
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.