55 Series, IC Sockets

Results:
254
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Operating Temperature
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Contact Material - Post
Housing Material
Type
Contact Material - Mating
Termination
Mounting Type
Pitch - Post
Features
Pitch - Mating
Results remaining254
Applied Filters:
55
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)SeriesHousing MaterialTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
44-3554-11
CONN IC DIP SOCKET ZIF 44POS GLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
44 (2 x 22)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
32-3552-10
CONN IC DIP SOCKET ZIF 32POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (2 x 16)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
28-6552-10
CONN IC DIP SOCKET ZIF 28POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
28-3552-10
CONN IC DIP SOCKET ZIF 28POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
28-6554-10
CONN IC DIP SOCKET ZIF 28POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
24-6554-10
CONN IC DIP SOCKET ZIF 24POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
48-6554-10
CONN IC DIP SOCKET ZIF 48POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
48 (2 x 24)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
32-6554-10
CONN IC DIP SOCKET ZIF 32POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (2 x 16)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
48-6552-10
CONN IC DIP SOCKET ZIF 48POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
48 (2 x 24)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
44-6553-11
CONN IC DIP SOCKET ZIF 44POS GLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
44 (2 x 22)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
42-6554-10
CONN IC DIP SOCKET ZIF 42POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
42 (2 x 21)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
44-6551-11
CONN IC DIP SOCKET ZIF 44POS GLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
44 (2 x 22)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
44-3553-11
CONN IC DIP SOCKET ZIF 44POS GLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
44 (2 x 22)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
44-3552-11
CONN IC DIP SOCKET ZIF 44POS GLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
44 (2 x 22)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
44-3551-11
CONN IC DIP SOCKET ZIF 44POS GLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
44 (2 x 22)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
28-3554-11
CONN IC DIP SOCKET ZIF 24POS GLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 250°C
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
28 (2 x 14)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
28-6553-11
CONN IC DIP SOCKET ZIF 28POS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Nickel Boron
Through Hole
Solder
0.100" (2.54mm)
Nickel Boron
28 (2 x 14)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
50.0µin (1.27µm)
Beryllium Copper
Closed Frame
50.0µin (1.27µm)
Beryllium Copper
28-3551-11
CONN IC DIP SOCKET ZIF 28POS GLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
28 (2 x 14)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
42-6552-10
CONN IC DIP SOCKET ZIF 42POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
42 (2 x 21)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
42-3553-10
CONN IC DIP SOCKET ZIF 42POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
42 (2 x 21)
55
Polyphenylene Sulfide (PPS), Glass Filled
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.