Textool™ Series, IC Sockets

Results:
139
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Pitch - Mating
Pitch - Post
Housing Material
Features
Contact Finish - Mating
Operating Temperature
Contact Finish Thickness - Mating
Termination
Mounting Type
Contact Material - Post
Contact Finish Thickness - Post
Contact Finish - Post
Contact Material - Mating
Results remaining139
Applied Filters:
Textool™
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesPitch - MatingContact Finish - MatingPitch - PostContact Finish - PostHousing MaterialOperating TemperatureMounting TypeNumber of Positions or Pins (Grid)TerminationTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
220-3342-00-0602J
CONN IC DIP SOCKET ZIF 20POS GLD
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Textool™
0.100" (2.54mm)
Gold
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Connector
20 (2 x 10)
Press-Fit
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
264-4493-00-0602J
CONN IC DIP SOCKET ZIF 64POS GLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Textool™
0.100" (2.54mm)
Gold
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Connector
64 (2 x 32)
Press-Fit
DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
210-2599-50-0602
3M TEXTOOL ZIP STRIP SOCKETS 210
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
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-
232-1270-01-0602
CONN SOCKET PGA ZIF 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.100" (2.54mm)
Gold
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Through Hole
32 (2 x 16)
Solder
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
232-1270-51-0602
STAGGERED ZIP STRIP POCKETS 32 C
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
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244-5205-00
3M TEXTOOL OPEN-TOP SOCKETS FOR
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
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-
268-4204-00
3M TEXTOOL 268-4204-00 QFN.4 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
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264-4205-00
3M TEXTOOL OPEN-TOP SOCKETS FOR
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
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200-6313-9UN-1900
CONN SOCKET PGA ZIF 169POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
0.100" (2.54mm)
Gold
0.100" (2.54mm)
Gold
Polyethersulfone (PES)
-55°C ~ 150°C
Through Hole
169 (13 x 13)
Solder
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
-
30.0µin (0.76µm)
Beryllium Copper
200-6317-9UN-1900
CONN SOCKET PGA ZIF 289POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.100" (2.54mm)
Gold
0.100" (2.54mm)
Gold
Polyethersulfone (PES)
-55°C ~ 150°C
Through Hole
289 (17 x 17)
Solder
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
-
30.0µin (0.76µm)
Beryllium Copper
CUSTOM BGA
CONN SOCKET BGA CUSTOM
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
0.026" ~ 0.050" (0.65mm ~ 1.27mm)
Custom
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-
Through Hole
Custom
-
BGA
Custom
-
Custom
-
-
232-1270-52-0602
STAGGERED ZIP STRIP POCKETS 32 C
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
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-
-
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234-3034-02-0602
CONN ZIG-ZAG ZIF 34POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.050" (1.27mm)
Gold
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Through Hole
34 (2 x 17)
Solder
Zig-Zag, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
255-7322-01-0602
3M TEXTOOL ZIP STRIP SOCKETS 255
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
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290-1294-00-3302J
CONN IC DIP SOCKET ZIF 90POS GLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.070" (1.78mm)
Gold
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Through Hole
90 (2 x 45)
Solder
DIP, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
234-3034-52-0602
CONN ZIG-ZAG ZIF 34POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.050" (1.27mm)
Gold
0.050" (1.27mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Through Hole
34 (2 x 17)
Solder
Zig-Zag, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
235-3019-51-0602
CONN ZIG-ZAG ZIF 35POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.050" (1.27mm)
Gold
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Through Hole
35 (1 x 17, 1 x 18)
Solder
Zig-Zag, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
235-3019-52-0602
CONN ZIG-ZAG ZIF 35POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.050" (1.27mm)
Gold
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Through Hole
35 (1 x 17, 1 x 18)
Solder
Zig-Zag, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
251-5949-51-0602
CONN ZIG-ZAG ZIF 51POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.050" (1.27mm)
Gold
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Through Hole
51 (1 x 25, 1 x 26)
Solder
Zig-Zag, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
251-5949-52-0602
CONN ZIG-ZAG ZIF 51POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
0.050" (1.27mm)
Gold
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Through Hole
51 (1 x 25, 1 x 26)
Solder
Zig-Zag, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.