ICA Series, IC Sockets

Results:
458
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Type
Contact Finish - Mating
Operating Temperature
Contact Finish - Post
Contact Material - Post
Housing Material
Termination
Mounting Type
Pitch - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining458
Applied Filters:
ICA
Select
ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
ICA-308-SGG
CONN IC DIP SOCKET 8POS GOLD
1+
$3.8028
5+
$3.5915
10+
$3.3803
Quantity
1,465 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (2 x 4)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-640-SGG
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-328-SGT
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
28 (2 x 14)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
ICA-632-ZEGT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
32 (2 x 16)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
ICA-308-SST-H
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
8 (2 x 4)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
-
Brass
ICA-640-ZAGG
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-640-WGG-2
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-316-SGT
CONN IC DIP SKT 16POS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
16 (2 x 8)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
ICA-628-SGG
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
28 (2 x 14)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-316-STT
CONN IC DIP SOCKET 16POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
16 (2 x 8)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Brass
ICA-320-SGG
CONN IC DIP SOCKET 20POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
20 (2 x 10)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-648-ZAGT
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
48 (2 x 24)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
ICA-648-WGT
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
48 (2 x 24)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
ICA-324-SGT
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
24 (2 x 12)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
ICA-648-ZWGT
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
48 (2 x 24)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
ICA-640-ZWGG
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-640-JGG
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polyester, Glass Filled
ICA
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-318-SGG
CONN IC DIP SOCKET 18POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
18 (2 x 9)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
ICA-422-SGT-L
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
22 (2 x 11)
Polyester, Glass Filled
ICA
DIP, 0.4" (10.16mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
ICA-314-ZWGT-2
.100" SCREW MACHINE DIP SOCKET
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
14 (2 x 7)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.