Lo-PRO®file, 513 Series, IC Sockets

Results:
244
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish Thickness - Post
Contact Finish - Post
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Pitch - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining244
Applied Filters:
Lo-PRO®file, 513
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
18-3513-10T
CONN IC DIP SOCKET 18POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
18 (2 x 9)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
16-3513-00
CONN IC DIP SOCKET 16POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
16 (2 x 8)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
16-3513-11
CONN IC DIP SOCKET 16POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
16 (2 x 8)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
06-6513-11H
CONN IC DIP SOCKET 6POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
6 (2 x 3)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
20-3513-10
CONN IC DIP SOCKET 20POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
20 (2 x 10)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
16-6513-10T
CONN IC DIP SOCKET 16POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
16 (2 x 8)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
08-2513-10H
CONN IC DIP SOCKET 8POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
08-3513-10H
CONN IC DIP SOCKET 8POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
10-2513-11
CONN IC DIP SOCKET 10POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (2 x 5)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
06-9513-10T
CONN IC DIP SOCKET 6POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
6 (2 x 3)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
40-9513-10
CONN IC DIP SOCKET 40POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
06-2513-11
CONN IC DIP SOCKET 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
6 (2 x 3)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
14-3513-10T
CONN IC DIP SOCKET 14POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
14 (2 x 7)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
10-3513-10T
CONN IC DIP SOCKET 10POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (2 x 5)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
08-4513-10
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.4" (10.16mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
10-2513-10T
CONN IC DIP SOCKET 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (2 x 5)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
08-3513-10T
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
06-6513-10T
CONN IC DIP SOCKET 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
6 (2 x 3)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
08-4513-10T
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.4" (10.16mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
06-2513-10T
CONN IC DIP SOCKET 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
6 (2 x 3)
-55°C ~ 105°C
Lo-PRO®file, 513
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.