503 Series, IC Sockets

Results:
183
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Operating Temperature
Contact Finish Thickness - Post
Contact Finish - Post
Contact Finish - Mating
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Pitch - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining183
Applied Filters:
503
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
30-9503-20
CONN IC DIP SOCKET 30POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
30 (2 x 15)
-55°C ~ 105°C
503
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
34-3503-31
CONN IC DIP SOCKET 34POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
34 (2 x 17)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
64-9503-30
CONN IC DIP SOCKET 64POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
64 (2 x 32)
-55°C ~ 105°C
503
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
50-9503-31
CONN IC DIP SOCKET 50POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
50 (2 x 25)
-55°C ~ 125°C
503
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
40-9503-20
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
503
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
30-9503-21
CONN IC DIP SOCKET 30POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
30 (2 x 15)
-55°C ~ 125°C
503
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
32-3503-31
CONN IC DIP SOCKET 32POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
32 (2 x 16)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
32-6503-21
CONN IC DIP SOCKET 32POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
32 (2 x 16)
-55°C ~ 125°C
503
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
40-9503-21
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 125°C
503
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
36-3503-31
CONN IC DIP SOCKET 36POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
36 (2 x 18)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
38-3503-21
CONN IC DIP SOCKET 38POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
38 (2 x 19)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
38-3503-31
CONN IC DIP SOCKET 38POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
38 (2 x 19)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
22-6503-21
CONN IC DIP SOCKET 22POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
22 (2 x 11)
-55°C ~ 125°C
503
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
24-6503-21
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
24 (2 x 12)
-55°C ~ 125°C
503
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
24-3503-21
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
24 (2 x 12)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
24-3503-31
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
24 (2 x 12)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
20-3503-21
CONN IC DIP SOCKET 20POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
20 (2 x 10)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
40-3503-21
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
40-6503-21
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 125°C
503
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
26-3503-21
CONN IC DIP SOCKET 26POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
26 (2 x 13)
-55°C ~ 125°C
503
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.