PGM Series, IC Sockets

Results:
118
Manufacturer
Series
Operating Temperature
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Contact Material - Post
Housing Material
Termination
Mounting Type
Number of Positions or Pins (Grid)
Pitch - Post
Type
Contact Material - Mating
Pitch - Mating
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Results remaining118
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingContact Finish Thickness - PostContact Material - Post
65-PGM10008-11
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
145-PGM15023-10
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
145-PGM15024-10
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
100-PGM13069-11
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
84-PGM11010-10
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
101-PGM13022-10H
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
175-PGM16008-11
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
132-PGM14016-10
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
133-PGM13046-10
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
133-PGM14013-10
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
175-PGM16010-10
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
84-PGM11010-40
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
209-PGM17030-11
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
209-PGM17046-11
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
68-PGM11032-11
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
68-PGM11033-11
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
108-PGM12005-10
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
85-PGM11008-11
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
100-PGM13061-10
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
144-PGM13095-11
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
-
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.