104 Series, IC Sockets

Results:
116
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Operating Temperature
Housing Material
Contact Finish Thickness - Mating
Contact Finish - Mating
Contact Material - Post
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining116
Applied Filters:
104
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePitch - MatingContact Finish - MatingMounting TypePitch - PostContact Finish - PostHousing MaterialSeriesNumber of Positions or Pins (Grid)TerminationTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
104-13-424-41-770000
CONN IC DIP SOCKET 24POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
24 (2 x 12)
Press-Fit
DIP, 0.4" (10.16mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-320-41-770000
CONN IC DIP SOCKET 20POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
20 (2 x 10)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-304-41-780000
CONN IC DIP SOCKET 4POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
4 (2 x 2)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-304-41-770000
CONN IC DIP SOCKET 4POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
4 (2 x 2)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-11-304-41-780000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104
4 (2 x 2)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-624-41-780000
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
24 (2 x 12)
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-11-642-41-770000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104
42 (2 x 21)
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-11-428-41-770000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104
28 (2 x 14)
Press-Fit
DIP, 0.4" (10.16mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-11-628-41-770000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104
28 (2 x 14)
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-11-328-41-770000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104
28 (2 x 14)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-322-41-770000
CONN IC DIP SOCKET 22POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
22 (2 x 11)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-324-41-770000
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
24 (2 x 12)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-322-41-780000
CONN IC DIP SOCKET 22POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
22 (2 x 11)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-632-41-770000
CONN IC DIP SOCKET 32POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
32 (2 x 16)
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-432-41-770000
CONN IC DIP SOCKET 32POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
32 (2 x 16)
Press-Fit
DIP, 0.4" (10.16mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-11-640-41-770000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104
40 (2 x 20)
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-11-624-41-780000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104
24 (2 x 12)
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-11-636-41-770000
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104
36 (2 x 18)
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-318-41-780000
CONN IC DIP SOCKET 18POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
18 (2 x 9)
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
104-13-422-41-770000
CONN IC DIP SOCKET 22POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
0.100" (2.54mm)
Gold
Thermoplastic
104
22 (2 x 11)
Press-Fit
DIP, 0.4" (10.16mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.