558 Series, IC Sockets

Results:
48
Manufacturer
Series
Number of Positions or Pins (Grid)
Mounting Type
Type
Features
Contact Material - Mating
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Pitch - Mating
Results remaining48
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558
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostOperating TemperatureTypeSeriesNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
558-10-576M30-001104
BGA SURFACE MOUNT 1.27MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
576 (30 x 30)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-600M35-001104
BGA SURFACE MOUNT 1.27MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
600 (35 x 35)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-576M30-001101
PGA SOLDER TAIL 1.27MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
576 (30 x 30)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-560M33-001104
BGA SURFACE MOUNT 1.27MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
560 (33 x 33)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-456M26-001101
PGA SOLDER TAIL 1.27MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
456 (26 x 26)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-432M31-001104
BGA SURFACE MOUNT 1.27MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
432 (31 x 31)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-478M26-131101
PGA SOLDER TAIL 1.27MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
478 (26 x 26)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-560M33-001101
PGA SOLDER TAIL 1.27MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
560 (33 x 33)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-292M20-001104
BGA SURFACE MOUNT 1.27MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
292 (20 x 20)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-192M16-001104
BGA SURFACE MOUNT 1.27MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
192 (16 x 16)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-352M26-001101
PGA SOLDER TAIL 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
352 (26 x 26)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-357M19-001104
BGA SURFACE MOUNT 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
357 (19 x 19)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-360M19-001104
BGA SURFACE MOUNT 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
360 (19 x 19)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-420M26-001101
PGA SOLDER TAIL 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
420 (26 x 26)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-388M26-001104
BGA SURFACE MOUNT 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
388 (26 x 26)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-420M26-001104
BGA SURFACE MOUNT 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
420 (26 x 26)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-272M20-001104
BGA SURFACE MOUNT 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
BGA
558
272 (20 x 20)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-292M20-001101
PGA SOLDER TAIL 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
292 (20 x 20)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-192M16-001101
PGA SOLDER TAIL 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
192 (16 x 16)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
558-10-357M19-001101
PGA SOLDER TAIL 1.27MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
PGA
558
357 (19 x 19)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.