8 Series, IC Sockets

Results:
446
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Contact Material - Post
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Contact Material - Mating
Operating Temperature
Housing Material
Termination
Mounting Type
Pitch - Post
Features
Pitch - Mating
Results remaining446
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
28-8300-610C
CONN IC DIP SOCKET 28POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
28-8350-610C
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
28-8370-610C
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
28-8375-610C
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
28-8495-610C
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
28-8600-610C
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
28-8670-610C
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
28-8675-610C
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
18-68660-10
CONN IC DIP SOCKET 18POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
18 (2 x 9)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame, Elevated
200.0µin (5.08µm)
Phosphor Bronze
08-8620-210C
CONN IC DIP SOCKET 8POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
-55°C ~ 105°C
8
DIP, 0.2" (5.08mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
10-81000-210C
CONN IC DIP SOCKET 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (2 x 5)
-55°C ~ 105°C
8
DIP, 0.2" (5.08mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
10-8350-210C
CONN IC DIP SOCKET 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (2 x 5)
-55°C ~ 105°C
8
DIP, 0.2" (5.08mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
10-8440-210C
CONN IC DIP SOCKET 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (2 x 5)
-55°C ~ 105°C
8
DIP, 0.2" (5.08mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
40-81150-610C
CONN IC DIP SOCKET 40POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
10-8875-210C
CONN IC DIP SOCKET 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (2 x 5)
-55°C ~ 105°C
8
DIP, 0.2" (5.08mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
40-8260-610C
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
40-8460-610C
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
40-8530-610C
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
18-811250-610C
CONN IC DIP SOCKET 18POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
18 (2 x 9)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass
40-8620-610C
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
8
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame, Elevated
10.0µin (0.25µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.