DILB Series, IC Sockets

Results:
5
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining5
Applied Filters:
DILB
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
DILB18P-223TLF
CONN IC DIP SOCKET 18POS TINLEAD
1+
$0.4873
5+
$0.4602
10+
$0.4331
Quantity
45,240 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
18 (2 x 9)
Polyamide (PA), Nylon
DILB
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB24P-224TLF
CONN IC DIP SOCKET 24POS TINLEAD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
24 (2 x 12)
Polyamide (PA), Nylon
DILB
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB32P-223TLF
CONN IC DIP SOCKET 32POS TINLEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
32 (2 x 16)
Polyamide (PA), Nylon
DILB
DIP, 0.6" (15.24mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB42P-223TLF
CONN IC DIP SOCKET 42POS TINLEAD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
42 (2 x 21)
Polyamide (PA), Nylon
DILB
DIP, 0.6" (15.24mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB24P-223TLF
CONN IC DIP SOCKET 24POS TINLEAD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
24 (2 x 12)
Polyamide (PA), Nylon
DILB
DIP, 0.6" (15.24mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.