SIP050-1x Series, IC Sockets

Results:
124
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Contact Finish Thickness - Mating
Operating Temperature
Contact Material - Post
Housing Material
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Type
Contact Finish - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining124
Applied Filters:
SIP050-1x
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
SIP050-1X04-157BLF
CONN SOCKET SIP 4POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
4 (1 x 4)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X27-157BLF
CONN SOCKET SIP 27POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
27 (1 x 27)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X18-157BLF
CONN SOCKET SIP 18POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
18 (1 x 18)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X02-157BLF
CONN SOCKET SIP 2POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
2 (1 x 2)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X04-160BLF
CONN SOCKET SIP 4POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
4 (1 x 4)
SIP050-1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X14-160BLF
CONN SOCKET SIP 14POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
SIP050-1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X05-157BLF
CONN SOCKET SIP 5POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
5 (1 x 5)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X20-160BLF
CONN SOCKET SIP 20POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
SIP050-1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X09-157BLF
CONN SOCKET SIP 9POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
9 (1 x 9)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X05-160BLF
CONN SOCKET SIP 5POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
5 (1 x 5)
SIP050-1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X06-157BLF
CONN SOCKET SIP 6POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
6 (1 x 6)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X10-157BLF
CONN SOCKET SIP 10POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
10 (1 x 10)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X09-160BLF
CONN SOCKET SIP 9POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
9 (1 x 9)
SIP050-1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X11-157BLF
CONN SOCKET SIP 11POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
11 (1 x 11)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X03-157BLF
CONN SOCKET SIP 3POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
3 (1 x 3)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X07-157BLF
CONN SOCKET SIP 7POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
7 (1 x 7)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X10-160BLF
CONN SOCKET SIP 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
10 (1 x 10)
SIP050-1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X19-157BLF
CONN SOCKET SIP 19POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
19 (1 x 19)
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X11-160BLF
CONN SOCKET SIP 11POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
11 (1 x 11)
SIP050-1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X08-160BLF
CONN SOCKET SIP 8POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
8 (1 x 8)
SIP050-1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.