Diplomate DL Series, IC Sockets

Results:
202
Manufacturer
Series
Number of Positions or Pins (Grid)
Housing Material
Operating Temperature
Contact Material - Post
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Features
Contact Finish - Mating
Type
Contact Finish - Post
Mounting Type
Contact Material - Mating
Termination
Pitch - Post
Pitch - Mating
Results remaining202
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Diplomate DL
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
2-382462-3
CONN IC DIP SOCKET 8POS TIN
1+
$0.5070
5+
$0.4789
10+
$0.4507
Quantity
364 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic
8 (2 x 4)
-55°C ~ 105°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
1-2199298-2
1+
$0.2155
5+
$0.2035
10+
$0.1915
Quantity
43 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Polybutylene Terephthalate (PBT), Glass Filled
8 (2 x 4)
-40°C ~ 105°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
-
Brass, Copper
1-2199299-2
28P,DIP SKT,600 CL,LDR,PB FREE
1+
$0.5070
5+
$0.4789
10+
$0.4507
Quantity
10 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Polybutylene Terephthalate (PBT), Glass Filled
28 (2 x 14)
-40°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Nickel
1-1825108-2
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Thermoplastic, Glass Filled
28 (2 x 14)
-55°C ~ 125°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
1-1825093-2
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Thermoplastic, Glass Filled
8 (2 x 4)
-55°C ~ 125°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
1825373-4
CONN IC DIP SOCKET 16POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Thermoplastic, Glass Filled
16 (2 x 8)
-55°C ~ 125°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Closed Frame
15.0µin (0.38µm)
Phosphor Bronze
2-641611-1
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic
18 (2 x 9)
-55°C ~ 105°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Beryllium Copper
1-382568-6
CONN IC DIP SOCKET 16POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
16 (2 x 8)
-55°C ~ 105°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
2-382713-1
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
18 (2 x 9)
-55°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Beryllium Copper
2-382713-6
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
18 (2 x 9)
-55°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Beryllium Copper
2-641267-3
CONN IC DIP SOCKET 28POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
2-382724-1
CONN IC DIP SOCKET 40POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Beryllium Copper
2-641606-2
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Thermoplastic, Glass Filled
40 (2 x 20)
-55°C ~ 125°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Beryllium Copper
2-641609-1
CONN IC DIP SOCKET 14POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
14 (2 x 7)
-55°C ~ 105°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
2-382882-1
CONN IC DIP SOCKET 6POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
6 (2 x 3)
-55°C ~ 105°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Beryllium Copper
2-641605-4
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Thermoplastic, Glass Filled
28 (2 x 14)
-55°C ~ 125°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Closed Frame
15.0µin (0.38µm)
Phosphor Bronze
2-641600-4
CONN IC DIP SOCKET 16POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Thermoplastic, Glass Filled
16 (2 x 8)
-55°C ~ 125°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Closed Frame
15.0µin (0.38µm)
Phosphor Bronze
643649-1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
17 (1 x 17)
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643654-1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
22 (1 x 22)
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643650-1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
18 (1 x 18)
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.