518 Series, IC Sockets

Results:
627
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Housing Material
Features
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Mounting Type
Pitch - Post
Pitch - Mating
Termination
Contact Material - Mating
Results remaining627
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518
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperaturePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
08-3518-00
CONN IC DIP SOCKET 8POS GOLD
1+
$3.8028
5+
$3.5915
10+
$3.3803
Quantity
171 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
518
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
50-9518-11H
CONN IC DIP SOCKET 50POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
50 (2 x 25)
518
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
64-9518-10M
CONN IC DIP SOCKET 64POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
64 (2 x 32)
518
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
518-77-192M16-001105
CONN SOCKET PGA 192POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
192 (16 x 16)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-192M16-001106
CONN SOCKET PGA 192POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
192 (16 x 16)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-272M20-001105
CONN SOCKET PGA 272POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
272 (20 x 20)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-41-447-20-116002
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.100" (2.54mm)
-
Solder
0.100" (2.54mm)
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
447 (20 x 20)
518
PGA
-
Beryllium Copper
-
-
Brass Alloy
518-43-391-18-096002
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
391 (18 x 18)
518
PGA
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass Alloy
518-91-391-18-096002
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
391 (18 x 18)
518
PGA
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass Alloy
32-6518-01
CONN IC DIP SOCKET 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
32 (2 x 16)
518
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
518-77-576M30-001105
CONN SOCKET PGA 576POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
576 (30 x 30)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-520M31-001106
CONN SOCKET PGA 520POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
520 (31 x 31)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-652M35-001105
CONN SOCKET PGA 652POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
652 (35 x 35)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-652M35-001106
CONN SOCKET PGA 652POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
652 (35 x 35)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-432M31-001105
CONN SOCKET PGA 432POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
432 (31 x 31)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-504M29-001105
CONN SOCKET PGA 504POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
504 (29 x 29)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-456M26-001106
CONN SOCKET PGA 456POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
456 (26 x 26)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-500M30-001106
CONN SOCKET PGA 500POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
500 (30 x 30)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-504M29-001106
CONN SOCKET PGA 504POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
504 (29 x 29)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-478M26-131105
CONN SOCKET PGA 478POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
478 (26 x 26)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.