501 Series, IC Sockets

Results:
250
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Operating Temperature
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Features
Contact Material - Post
Housing Material
Termination
Mounting Type
Pitch - Post
Contact Material - Mating
Pitch - Mating
Results remaining250
Applied Filters:
501
Select
ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
14-3501-31
CONN IC DIP SOCKET 14POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
14 (2 x 7)
501
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
11-0501-30
CONN SOCKET SIP 11POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
11 (1 x 11)
501
SIP
200.0µin (5.08µm)
Phosphor Bronze
-
200.0µin (5.08µm)
Phosphor Bronze
10-0501-20
CONN SOCKET SIP 10POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
10 (1 x 10)
501
SIP
200.0µin (5.08µm)
Phosphor Bronze
-
200.0µin (5.08µm)
Phosphor Bronze
07-0501-31
CONN SOCKET SIP 7POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
7 (1 x 7)
501
SIP
10.0µin (0.25µm)
Phosphor Bronze
-
10.0µin (0.25µm)
Phosphor Bronze
10-6501-31
CONN IC DIP SOCKET 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
10 (2 x 5)
501
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
09-0501-30
CONN SOCKET SIP 9POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
9 (1 x 9)
501
SIP
200.0µin (5.08µm)
Phosphor Bronze
-
200.0µin (5.08µm)
Phosphor Bronze
22-6501-30
CONN IC DIP SOCKET 22POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
22 (2 x 11)
501
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
24-6501-30
CONN IC DIP SOCKET 24POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
24 (2 x 12)
501
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
06-0501-21
CONN SOCKET SIP 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
6 (1 x 6)
501
SIP
10.0µin (0.25µm)
Phosphor Bronze
-
10.0µin (0.25µm)
Phosphor Bronze
06-0501-31
CONN SOCKET SIP 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
6 (1 x 6)
501
SIP
10.0µin (0.25µm)
Phosphor Bronze
-
10.0µin (0.25µm)
Phosphor Bronze
04-0501-20
CONN SOCKET SIP 4POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
4 (1 x 4)
501
SIP
200.0µin (5.08µm)
Phosphor Bronze
-
200.0µin (5.08µm)
Phosphor Bronze
18-6501-30
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
18 (2 x 9)
501
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
18-6501-20
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
18 (2 x 9)
501
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
12-0501-30
CONN SOCKET SIP 12POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
12 (1 x 12)
501
SIP
200.0µin (5.08µm)
Phosphor Bronze
-
200.0µin (5.08µm)
Phosphor Bronze
18-3501-30
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
18 (2 x 9)
501
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
08-2501-21
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
8 (2 x 4)
501
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
08-3501-21
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
8 (2 x 4)
501
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
16-3501-20
CONN IC DIP SOCKET 16POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
16 (2 x 8)
501
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
08-0501-20
CONN SOCKET SIP 8POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
8 (1 x 8)
501
SIP
200.0µin (5.08µm)
Phosphor Bronze
-
200.0µin (5.08µm)
Phosphor Bronze
10-2501-20
CONN IC DIP SOCKET 10POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
10 (2 x 5)
501
DIP, 0.2" (5.08mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.