OEM Series, IC Sockets

Results:
11
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Housing Material
Contact Finish - Mating
Operating Temperature
Contact Finish - Post
Features
Contact Material - Post
Termination
Mounting Type
Pitch - Post
Pitch - Mating
Contact Material - Mating
Results remaining11
Applied Filters:
OEM
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
232-1297-00-3303
CONN IC DIP SOCKET ZIF 32POS GLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
32 (2 x 16)
-55°C ~ 105°C
OEM
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
250.0µin (6.35µm)
Beryllium Copper
Closed Frame
250.0µin (6.35µm)
Beryllium Copper
Polyether Imide (PEI), Glass Filled
268-5401-50-1102JH
CONN SOCKET CLCC 68POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
68 (4 x 17)
-55°C ~ 105°C
OEM
CLCC
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
268-5401-52-1102JH
CONN SOCKET CLCC 68POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
68 (4 x 17)
-55°C ~ 105°C
OEM
CLCC
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
220-4842-00-3303
CONN IC DIP SOCKET ZIF 20POS GLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
20 (2 x 10)
-55°C ~ 105°C
OEM
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
250.0µin (6.35µm)
Beryllium Copper
Closed Frame
250.0µin (6.35µm)
Beryllium Copper
Polyether Imide (PEI), Glass Filled
2100-7243-00-1807
CONN SOCKET PQFP 100POS TIN-LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Tin-Lead
Through Hole
Solder
-
Tin-Lead
100 (4 x 25)
0°C ~ 105°C
OEM
QFP
200.0µin (5.08µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
268-5401-00-1102JH
CONN SOCKET CLCC 68POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
68 (4 x 17)
-55°C ~ 105°C
OEM
CLCC
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
232-1271-00-1102JH
OEM LCC SOCKETS 32 POS SOLID LID
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
OEM
-
-
-
-
-
-
-
284-1273-00-1102JH
CONN SOCKET PLCC 84POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
84 (4 x 21)
-55°C ~ 105°C
OEM
PLCC
Flash
Beryllium Copper
Open Frame
Flash
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
216-6278-00-3303
CONN IC DIP SOCKET ZIF 16POS GLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
16 (2 x 8)
-55°C ~ 105°C
OEM
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
250.0µin (6.35µm)
Beryllium Copper
Closed Frame
250.0µin (6.35µm)
Beryllium Copper
Polyether Imide (PEI), Glass Filled
240-4846-00-3303
CONN IC DIP SOCKET ZIF 40POS GLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
40 (2 x 20)
-55°C ~ 105°C
OEM
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
250.0µin (6.35µm)
Beryllium Copper
Closed Frame
250.0µin (6.35µm)
Beryllium Copper
Polyether Imide (PEI), Glass Filled
268-5401-11-1102JH
CONN SOCKET CLCC 68POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
68 (4 x 17)
-55°C ~ 105°C
OEM
CLCC
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.