Edge-Grip™, C91 Series, IC Sockets

Results:
9
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Contact Material - Mating
Features
Pitch - Mating
Results remaining9
Applied Filters:
Edge-Grip™, C91
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
C9108-00
CONN IC DIP SOCKET 8POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
8 (2 x 4)
Edge-Grip™, C91
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
C9114-00
CONN IC DIP SOCKET 14POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
14 (2 x 7)
Edge-Grip™, C91
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
C9116-00
CONN IC DIP SOCKET 16POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
16 (2 x 8)
Edge-Grip™, C91
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
C9118-00
CONN IC DIP SOCKET 18POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
18 (2 x 9)
Edge-Grip™, C91
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
C9120-00
CONN IC DIP SOCKET 20POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
20 (2 x 10)
Edge-Grip™, C91
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
C9122-00
CONN IC DIP SOCKET 22POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
22 (2 x 11)
Edge-Grip™, C91
DIP, 0.4" (10.16mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
C9124-00
CONN IC DIP SOCKET 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
24 (2 x 12)
Edge-Grip™, C91
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
C9128-00
CONN IC DIP SOCKET 28POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
28 (2 x 14)
Edge-Grip™, C91
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze
C9140-00
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
40 (2 x 20)
Edge-Grip™, C91
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
10.0µin (0.25µm)
Phosphor Bronze

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.