508 Series, IC Sockets

Results:
393
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Features
Operating Temperature
Housing Material
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Pitch - Mating
Contact Finish - Mating
Contact Material - Post
Termination
Mounting Type
Contact Material - Mating
Results remaining393
Applied Filters:
508
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
22-1508-31
CONN IC DIP SOCKET 22POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
22 (2 x 11)
Polyamide (PA46), Nylon 4/6
508
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
32-6508-30
CONN IC DIP SOCKET 32POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
-55°C ~ 105°C
32 (2 x 16)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
27-0508-21
CONN SOCKET SIP 27POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
-
Gold
-55°C ~ 125°C
27 (1 x 27)
Polyamide (PA46), Nylon 4/6
508
SIP
10.0µin (0.25µm)
Beryllium Copper
-
10.0µin (0.25µm)
Brass
40-0508-20
CONN SOCKET SIP 40POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
-
Gold
-55°C ~ 105°C
40 (1 x 40)
Polyamide (PA46), Nylon 4/6
508
SIP
10.0µin (0.25µm)
Beryllium Copper
-
10.0µin (0.25µm)
Brass
40-6508-301
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
-55°C ~ 105°C
40 (2 x 20)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
24-3508-21
CONN IC DIP SOCKET 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
28-3508-212
CONN IC DIP SOCKET 28POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
28 (2 x 14)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
28-3508-31
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
28 (2 x 14)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
32-0508-21
CONN SOCKET SIP 32POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
-
Tin
-55°C ~ 125°C
32 (1 x 32)
Polyamide (PA46), Nylon 4/6
508
SIP
10.0µin (0.25µm)
Beryllium Copper
-
200.0µin (5.08µm)
Brass
32-1508-21
CONN IC DIP SOCKET 32POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (2 x 16)
Polyamide (PA46), Nylon 4/6
508
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
24-6508-312
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
35-0508-21
CONN SOCKET SIP 35POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
-
Tin
-55°C ~ 125°C
35 (1 x 35)
Polyamide (PA46), Nylon 4/6
508
SIP
10.0µin (0.25µm)
Beryllium Copper
-
200.0µin (5.08µm)
Brass
24-4508-30
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
-55°C ~ 105°C
24 (2 x 12)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.4" (10.16mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
14-3508-212
CONN IC DIP SOCKET 14POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
14 (2 x 7)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
40-1508-20
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
-55°C ~ 105°C
40 (2 x 20)
Polyamide (PA46), Nylon 4/6
508
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
34-0508-21
CONN SOCKET SIP 34POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
-
Tin
-55°C ~ 125°C
34 (1 x 34)
Polyamide (PA46), Nylon 4/6
508
SIP
10.0µin (0.25µm)
Beryllium Copper
-
200.0µin (5.08µm)
Brass
34-1508-21
CONN IC DIP SOCKET 34POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
34 (2 x 17)
Polyamide (PA46), Nylon 4/6
508
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
40-1508-31
CONN IC DIP SOCKET 40POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polyamide (PA46), Nylon 4/6
508
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
32-6508-211
CONN IC DIP SOCKET 32POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (2 x 16)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
50-9508-20
CONN IC DIP SOCKET 50POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
-55°C ~ 105°C
50 (2 x 25)
Polyamide (PA46), Nylon 4/6, Glass Filled
508
DIP, 0.9" (22.86mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.