APA Series, IC Sockets

Results:
273
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Operating Temperature
Contact Material - Post
Housing Material
Termination
Mounting Type
Pitch - Post
Type
Contact Material - Mating
Features
Pitch - Mating
Results remaining273
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ImageProduct DetailPriceAvailabilityECAD ModelTypeOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialSeriesContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
APA-316-T-M
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-628-G-A
CONN ADAPTER PLUG 28POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-320-G-M
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
20 (2 x 10)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-316-G-A1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-318-T-N
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
18 (2 x 9)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-324-T-A1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-314-G-J
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
14 (2 x 7)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-308-G-M
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-320-T-A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (2 x 10)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-308-G-A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-422-G-C
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
22 (2 x 11)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-318-T-A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
18 (2 x 9)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-316-T-A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-316-T-A1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-316-T-J
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-308-T-M
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-628-G-A1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-624-G-N
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze
APA-648-T-N
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
48 (2 x 24)
Polybutylene Terephthalate (PBT), Glass Filled
APA
-
Phosphor Bronze
Open Frame
-
Phosphor Bronze
APA-422-G-M
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
22 (2 x 11)
Polybutylene Terephthalate (PBT), Glass Filled
APA
20.0µin (0.51µm)
Phosphor Bronze
Open Frame
20.0µin (0.51µm)
Phosphor Bronze

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.