714 Series, IC Sockets

Results:
112
Manufacturer
Series
Number of Positions or Pins (Grid)
Features
Contact Finish Thickness - Post
Type
Contact Finish - Post
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Pitch - Post
Contact Material - Mating
Pitch - Mating
Results remaining112
Applied Filters:
714
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
714-43-206-31-018000
CONN IC DIP SOCKET 6POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
6 (2 x 3)
714
DIP, 0.1" (2.54mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Closed Frame
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-254-31-018000
CONN IC DIP SOCKET 54POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
54 (2 x 27)
714
DIP, 0.1" (2.54mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Closed Frame
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-124-31-018000
CONN SOCKET SIP 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (1 x 24)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-123-31-018000
CONN SOCKET SIP 23POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
23 (1 x 23)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-119-31-018000
CONN SOCKET SIP 19POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
19 (1 x 19)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-214-31-018000
CONN IC DIP SOCKET 14POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
14 (2 x 7)
714
DIP, 0.1" (2.54mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Closed Frame
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-210-31-018000
CONN IC DIP SOCKET 10POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
10 (2 x 5)
714
DIP, 0.1" (2.54mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Closed Frame
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-111-31-018000
CONN SOCKET SIP 11POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
11 (1 x 11)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-109-31-018000
CONN SOCKET SIP 9POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
9 (1 x 9)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-208-31-018000
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (2 x 4)
714
DIP, 0.1" (2.54mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Closed Frame
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-103-31-018000
CONN SOCKET SIP 3POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
3 (1 x 3)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-105-31-018000
CONN SOCKET SIP 5POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
5 (1 x 5)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-204-31-018000
CONN IC DIP SOCKET 4POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
4 (2 x 2)
714
DIP, 0.1" (2.54mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Closed Frame
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-162-31-018000
CONN SOCKET SIP 62POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
62 (1 x 62)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-256-31-018000
CONN IC DIP SOCKET 56POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
56 (2 x 28)
714
DIP, 0.1" (2.54mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Closed Frame
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-161-31-018000
CONN SOCKET SIP 61POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
61 (1 x 61)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-258-31-018000
CONN IC DIP SOCKET 58POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
58 (2 x 29)
714
DIP, 0.1" (2.54mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Carrier, Closed Frame
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-108-31-018000
CONN SOCKET SIP 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (1 x 8)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-106-31-018000
CONN SOCKET SIP 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
6 (1 x 6)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-104-31-018000
CONN SOCKET SIP 4POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
4 (1 x 4)
714
SIP
30.0µin (0.76µm)
Beryllium Copper
Carrier
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.