551 Series, IC Sockets

Results:
749
Manufacturer
Series
Number of Positions or Pins (Grid)
Features
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Operating Temperature
Contact Material - Post
Housing Material
Termination
Mounting Type
Pitch - Post
Type
Pitch - Mating
Contact Material - Mating
Results remaining749
Applied Filters:
551
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostSeriesTypeNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingContact Finish Thickness - PostContact Material - PostHousing Material
551-10-012-05-001005
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
12 (5 x 5)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-022-05-001005
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
22 (5 x 5)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-025-05-000004
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
25 (5 x 5)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-028-06-005004
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
28 (6 x 6)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-032-01-503004
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
32 (1 x 1)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-032-09-041003
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
32 (9 x 9)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-044-08-031003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
44 (8 x 8)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-044-08-031005
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
44 (8 x 8)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-045-08-005004
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
45 (8 x 8)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-052-09-045003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
52 (9 x 9)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-056-09-041005
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
56 (9 x 9)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-064-08-000003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Closed Frame
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
64 (8 x 8)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-072-11-042003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
72 (11 x 11)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-072-11-061004
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
72 (11 x 11)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-073-11-042004
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
73 (11 x 11)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-073-11-042005
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
73 (11 x 11)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-10-073-11-061004
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
551
PGA
73 (11 x 11)
10.0µin (0.25µm)
-
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-90-256-19-081003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
-
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
551
PGA
256 (19 x 19)
200.0µin (5.08µm)
-
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-90-256-19-081005
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
551
PGA
256 (19 x 19)
200.0µin (5.08µm)
-
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
551-90-273-21-125003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
551
PGA
273 (21 x 21)
200.0µin (5.08µm)
-
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.