6621 Series, IC Sockets

Results:
18
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Type
Contact Finish - Post
Contact Material - Mating
Features
Pitch - Mating
Results remaining18
Applied Filters:
6621
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesContact Finish Thickness - PostContact Material - Post
24-6621-30
CONN IC DIP SOCKET 24POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
24 (2 x 12)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
16-6621-30
CONN IC DIP SOCKET 16POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
16 (2 x 8)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
18-6621-30
CONN IC DIP SOCKET 18POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
18 (2 x 9)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
14-6621-30
CONN IC DIP SOCKET 14POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
14 (2 x 7)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
12-6621-30
CONN IC DIP SOCKET 12POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
12 (2 x 6)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
10-6621-30
CONN IC DIP SOCKET 10POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (2 x 5)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
08-6621-30
CONN IC DIP SOCKET 8POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
32-6621-30
CONN IC DIP SOCKET 32POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
32 (2 x 16)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
26-6621-30
CONN IC DIP SOCKET 26POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
26 (2 x 13)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
22-6621-30
CONN IC DIP SOCKET 22POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
22 (2 x 11)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
36-6621-30
CONN IC DIP SOCKET 36POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
36 (2 x 18)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
20-6621-30
CONN IC DIP SOCKET 20POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
20 (2 x 10)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
40-6621-30
CONN IC DIP SOCKET 40POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
48-6621-30
CONN IC DIP SOCKET 48POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
48 (2 x 24)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
34-6621-30
CONN IC DIP SOCKET 34POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
34 (2 x 17)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
38-6621-30
CONN IC DIP SOCKET 38POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
38 (2 x 19)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
28-6621-30
CONN IC DIP SOCKET 28POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
30-6621-30
CONN IC DIP SOCKET 30POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
30 (2 x 15)
-55°C ~ 105°C
6621
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Bottom Entry; Through Board
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.