IC Sockets

Results:
23,934
Manufacturer
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Number of Positions or Pins (Grid)
Contact Finish Thickness - Post
Pitch - Post
Series
Type
Contact Finish - Post
Features
Contact Material - Mating
Pitch - Mating
Results remaining23,934
Select
ImageProduct DetailPriceAvailabilityECAD ModelTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
DILB18P-223TLF
CONN IC DIP SOCKET 18POS TINLEAD
1+
$0.4839
5+
$0.4570
10+
$0.4301
Quantity
45,240 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 125°C
2-2129710-5
CONN SOCKET LGA 3647POS GOLD
1+
$20.1399
5+
$19.0210
10+
$17.9021
Quantity
8,930 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
LGA
3647
-
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
-
-
-
Copper Alloy
Thermoplastic
-
2-2129710-6
CONN SOCKET LGA 3647POS GOLD
1+
$22.6573
5+
$21.3986
10+
$20.1399
Quantity
7,853 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
LGA
3647
-
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
-
-
-
Copper Alloy
Thermoplastic
-
808-AG11D-ESL-LF
1+
$1.0070
5+
$0.9510
10+
$0.8951
Quantity
7,782 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
4828-6004-CP
CONN IC DIP SOCKET 28POS TIN
1+
$2.1650
5+
$2.0448
10+
$1.9245
Quantity
3,740 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
114-87-316-41-134161
CONN IC DIP SOCKET 16POS GOLD
1+
$1.6490
5+
$1.5573
10+
$1.4657
Quantity
2,450 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1-390261-2
CONN IC DIP SOCKET 8POS TIN
1+
$0.3776
5+
$0.3566
10+
$0.3357
Quantity
1,759 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
1-2324271-3
RIGHT SEGMEN LGA4189-4 SOCKET-P4
1+
$23.9161
5+
$22.5874
10+
$21.2587
Quantity
1,563 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
LGA 4189
2092
0.039" (1.00mm)
Gold
15.0µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.034" (0.86mm)
Gold
15.0µin (0.38µm)
Copper Alloy
Thermoplastic
-25°C ~ 100°C
ICA-308-SGG
CONN IC DIP SOCKET 8POS GOLD
1+
$3.7762
5+
$3.5664
10+
$3.3566
Quantity
1,465 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass
Polyester, Glass Filled
-55°C ~ 125°C
820-AG11D-ESL-LF
1+
$2.5603
5+
$2.4180
10+
$2.2758
Quantity
1,132 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
110-87-308-41-001101
CONN IC DIP SOCKET 8POS GOLD
1+
$8.8112
5+
$8.3217
10+
$7.8322
Quantity
807 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
110-87-632-41-001101
CONN IC DIP SOCKET 32POS GOLD
1+
$3.9524
5+
$3.7329
10+
$3.5133
Quantity
661 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
5-1571552-0
CONN IC DIP SOCKET 32POS GOLD
1+
$5.5385
5+
$5.2308
10+
$4.9231
Quantity
600 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
1-2324271-1
RIGHT SEGMEN LGA4189-4 SOCKET-P4
1+
$44.3077
5+
$41.8462
10+
$39.3846
Quantity
538 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
LGA 4189
2092
0.039" (1.00mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.034" (0.86mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Thermoplastic
-25°C ~ 100°C
1-2324271-2
LEFT SEGMEN LGA4189-4 SOCKET-P4
1+
$31.4685
5+
$29.7203
10+
$27.9720
Quantity
536 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
LGA 4189
2092
0.039" (1.00mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.034" (0.86mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Thermoplastic
-25°C ~ 100°C
917-93-103-41-005000
CONN TRANSIST TO-5 3POS GOLD
1+
$2.4898
5+
$2.3515
10+
$2.2131
Quantity
500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Transistor, TO-5
3 (Round)
-
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
822473-4
CONN SOCKET PLCC 44POS TIN-LEAD
1+
$0.7552
5+
$0.7133
10+
$0.6713
Quantity
500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin-Lead
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
-
Phosphor Bronze
Thermoplastic
-
540-88-044-24-008
CONN SOCKET PLCC 44POS TIN
1+
$1.5105
5+
$1.4266
10+
$1.3427
Quantity
483 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-
ICS-320-T
IC SOCKET, DIP, 20P 2.54MM PITCH
1+
$0.3021
5+
$0.2853
10+
$0.2685
Quantity
470 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
2-382462-3
CONN IC DIP SOCKET 8POS TIN
1+
$0.5035
5+
$0.4755
10+
$0.4476
Quantity
364 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic
-55°C ~ 105°C

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.