IC Sockets

Results:
23,956
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
Results remaining23,956
Select
ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
DILB18P-223TLF
CONN IC DIP SOCKET 18POS TINLEAD
1+
$0.4873
5+
$0.4602
10+
$0.4331
Quantity
45,240 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
18 (2 x 9)
Polyamide (PA), Nylon
DILB
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
1-822473-4
1+
$0.6338
5+
$0.5986
10+
$0.5634
Quantity
10,050 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-
44 (4 x 11)
Thermoplastic
-
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
2-2129710-5
CONN SOCKET LGA 3647POS GOLD
1+
$20.2817
5+
$19.1549
10+
$18.0282
Quantity
8,930 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
Gold
Surface Mount
Solder
-
-
-
3647
Thermoplastic
-
LGA
30.0µin (0.76µm)
Copper Alloy
Open Frame
-
Copper Alloy
2-2129710-6
CONN SOCKET LGA 3647POS GOLD
1+
$22.8169
5+
$21.5493
10+
$20.2817
Quantity
7,853 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
Gold
Surface Mount
Solder
-
-
-
3647
Thermoplastic
-
LGA
30.0µin (0.76µm)
Copper Alloy
Open Frame
-
Copper Alloy
1-2199298-3
CONN IC DIP SOCKET 14POS TIN
1+
$0.2358
5+
$0.2227
10+
$0.2096
Quantity
7,571 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
14 (2 x 7)
Polybutylene Terephthalate (PBT), Glass Filled
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
-
Brass, Copper
808-AG11D-ESL-LF
1+
$1.5211
5+
$1.4366
10+
$1.3521
Quantity
5,208 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 105°C
8 (2 x 4)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
800
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
Flash
Copper
110-87-314-41-001101
CONN IC DIP SOCKET 14POS GOLD
1+
$2.5352
5+
$2.3944
10+
$2.2535
Quantity
4,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
14 (2 x 7)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
4828-6004-CP
CONN IC DIP SOCKET 28POS TIN
1+
$2.1803
5+
$2.0592
10+
$1.9380
Quantity
3,740 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
28 (2 x 14)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
114-87-316-41-134161
CONN IC DIP SOCKET 16POS GOLD
1+
$1.6606
5+
$1.5683
10+
$1.4761
Quantity
2,450 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
16 (2 x 8)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
940-44-068-24-000000
CONN SOCKET PLCC 68POS TIN
1+
$2.5352
5+
$2.3944
10+
$2.2535
Quantity
2,163 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
68 (4 x 17)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
940
PLCC
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass Alloy
1-390261-2
CONN IC DIP SOCKET 8POS TIN
1+
$0.3803
5+
$0.3592
10+
$0.3380
Quantity
1,759 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
8 (2 x 4)
-
-
DIP, 0.3" (7.62mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
1-2324271-3
RIGHT SEGMEN LGA4189-4 SOCKET-P4
1+
$24.0845
5+
$22.7465
10+
$21.4085
Quantity
1,563 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.039" (1.00mm)
Gold
Surface Mount
Solder
0.034" (0.86mm)
Gold
-25°C ~ 100°C
2092
Thermoplastic
-
LGA 4189
15.0µin (0.38µm)
Copper Alloy
Open Frame
15.0µin (0.38µm)
Copper Alloy
ICA-308-SGG
CONN IC DIP SOCKET 8POS GOLD
1+
$3.8028
5+
$3.5915
10+
$3.3803
Quantity
1,465 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (2 x 4)
Polyester, Glass Filled
ICA
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Brass
820-AG11D-ESL-LF
1+
$2.5783
5+
$2.4351
10+
$2.2918
Quantity
1,132 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 105°C
20 (2 x 10)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
800
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
Flash
Copper
110-87-632-41-001101
CONN IC DIP SOCKET 32POS GOLD
1+
$3.9803
5+
$3.7592
10+
$3.5380
Quantity
661 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
32 (2 x 16)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110
DIP, 0.6" (15.24mm) Row Spacing
Flash
Beryllium Copper
Open Frame
-
Brass
5-1571552-0
CONN IC DIP SOCKET 32POS GOLD
1+
$5.5775
5+
$5.2676
10+
$4.9577
Quantity
600 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 105°C
32 (2 x 16)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
800
DIP, 0.6" (15.24mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Open Frame
20.0µin (0.51µm)
Copper
1-2324271-1
RIGHT SEGMEN LGA4189-4 SOCKET-P4
1+
$44.6197
5+
$42.1408
10+
$39.6620
Quantity
538 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.039" (1.00mm)
Gold
Surface Mount
Solder
0.034" (0.86mm)
Gold
-25°C ~ 100°C
2092
Thermoplastic
-
LGA 4189
30.0µin (0.76µm)
Copper Alloy
Open Frame
30.0µin (0.76µm)
Copper Alloy
1-2324271-2
LEFT SEGMEN LGA4189-4 SOCKET-P4
1+
$31.6901
5+
$29.9296
10+
$28.1690
Quantity
536 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.039" (1.00mm)
Gold
Surface Mount
Solder
0.034" (0.86mm)
Gold
-25°C ~ 100°C
2092
Thermoplastic
-
LGA 4189
30.0µin (0.76µm)
Copper Alloy
Open Frame
30.0µin (0.76µm)
Copper Alloy
822473-4
CONN SOCKET PLCC 44POS TIN-LEAD
1+
$0.7606
5+
$0.7183
10+
$0.6761
Quantity
500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
44 (4 x 11)
Thermoplastic
-
PLCC
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
917-93-103-41-005000
CONN TRANSIST TO-5 3POS GOLD
1+
$2.5073
5+
$2.3680
10+
$2.2287
Quantity
500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
Gold
Through Hole
Solder
-
Tin-Lead
-55°C ~ 125°C
3 (Round)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917
Transistor, TO-5
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass Alloy

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.