700 Series, IC Sockets

Results:
12
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Mounting Type
Contact Finish Thickness - Post
Contact Finish - Post
Features
Contact Material - Mating
Termination
Pitch - Post
Pitch - Mating
Results remaining12
Applied Filters:
700
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
6-1437542-2
CONN IC DIP SOCKET 40POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
700
DIP, 0.6" (15.24mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
2-1437542-2
CONN IC DIP SOCKET 18POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole, Right Angle, Vertical
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
18 (2 x 9)
700
DIP, 0.3" (7.62mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
1-1437542-0
CONN IC DIP SOCKET 8POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (2 x 4)
700
DIP, 0.3" (7.62mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
1-1437542-1
CONN IC DIP SOCKET 8POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (2 x 4)
700
DIP, 0.3" (7.62mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
1-1437542-9
CONN IC DIP SOCKET 16POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
16 (2 x 8)
700
DIP, 0.3" (7.62mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
1437542-6
CONN IC DIP SOCKET 6POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
6 (2 x 3)
700
DIP, 0.3" (7.62mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
2-1437542-9
CONN IC DIP SOCKET 20POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
20 (2 x 10)
700
DIP, 0.3" (7.62mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
4-1437542-5
CONN IC DIP SOCKET 24POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
700
DIP, 0.6" (15.24mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
5-1437542-2
CONN IC DIP SOCKET 28POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
28 (2 x 14)
700
DIP, 0.6" (15.24mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
5-1437542-8
CONN IC DIP SOCKET 32POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (2 x 16)
700
DIP, 0.6" (15.24mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
2-1437542-7
CONN IC DIP SOCKET 20POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
20 (2 x 10)
700
DIP, 0.3" (7.62mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
20-7800-10
CONN SOCKET SIP 20POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
20 (1 x 20)
700
SIP
200.0µin (5.08µm)
Phosphor Bronze
Carrier, Elevated
200.0µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.