IC 夹

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184
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Series
Number of Positions or Pins (Grid)
Type
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ImageProduct DetailPriceAvailabilityECAD ModelContact FinishContact MaterialNumber of Positions or Pins (Grid)SeriesType
5108
TEST CLIP DIP 8 (2 X 4)
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Gold
Beryllium Copper
8 (2 x 4)
DIP Clip®
DIP, Standard
5208
TEST CLIP DIP 8 (2 X 4)
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Gold
Beryllium Copper
8 (2 x 4)
DIP Clip®
DIP, Open Back
5998AL
TEST CLIP QFP 240 (17 X 17)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
-
240 (17 x 17)
5998
QFP, 0.50mm Pitch
923743-48
48 PIN GOLD TEST CLIP
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
Copper Alloy
48 (2 x 24)
923
DIP, .600"
923715
24 PIN TEST CLIP .3 ROW SPACE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Copper Alloy
24 (2 x 12)
923
DIP, .300"
923670-44
TEST CLIP PLCC 44 (4 X 11)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Copper Alloy
44 (4 x 11)
923
PLCC, .050"
923670-28
TEST CLIP PLCC 28 (4 X 7)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Copper Alloy
28 (4 x 7)
923
PLCC, .050"
923690-64
TEST CLIP DIP 64 (2 X 32)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Copper Alloy
64 (2 x 32)
923
DIP, .900"
5254
TEST CLIP SOIC 24 (2 X 12)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
-
24 (2 x 12)
SOIC Clip®
SOIC, 0.15 to 0.35" Wide
5253
TEST CLIP SOIC 20 (2 X 10)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
-
20 (2 x 10)
SOIC Clip®
SOIC, 0.15 to 0.35" Wide
6150
TEST CLIP QFP 100 (11 X 11)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
-
100 (11 x 11)
6150
QFP, 0.50mm Pitch
5220
TEST CLIP DIP 20 (2 X 10)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
Beryllium Copper
20 (2 x 10)
DIP Clip®
DIP, Open Back
923739-64
TEST CLIP DIP 64 (2 X 32)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
Copper Alloy
64 (2 x 32)
923
DIP, .900"
5998A
TEST CLIP QFP 240 (17 X 17)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
-
240 (17 x 17)
5998
QFP, 0.50mm Pitch
5893
TEST CLIP SSOP 48 (2 X 24)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
-
48 (2 x 24)
5893
SSOP, 0.025" Pitch
5888
TEST CLIP QFP 64 (4 X 16)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
-
64 (4 x 16)
EIAJ
QFP, 0.80mm Pitch
5878
TEST CLIP PLCC 32 (2 X 7/2 X 9)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
-
32 (2 x 7, 2 x 9)
5878
PLCC
923738-24
TEST CLIP DIP 24 (2 X 12)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
Copper Alloy
24 (2 x 12)
923
DIP, .300"
923743-18
TEST CLIP DIP 18 (2 X 9)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gold
Copper Alloy
18 (2 x 9)
923
DIP, .300"
923680-44
TEST CLIP LCC 44 (4 X 11)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Copper Alloy
44 (4 x 11)
923
LCC, .050"

IC 夹

IC芯片的测试夹是一种必备工具,用于在IC芯片和测量设备之间建立临时电气连接。这些夹子专门设计有多个接触点和弹簧装置,以确保与IC引脚之间可靠而安全的连接。 常见的电子电路中使用了几种类型的IC封装,而测试夹可以适配各种不同的IC封装风格。以下是一些常见的IC封装类型: DIP(双行直插封装):DIP测试夹设计用于连接引脚排列成两行平行的IC。这种封装风格通常用于较早的插针技术。 LCC(无引线芯片封装):LCC测试夹用于具有无引线芯片封装的IC。这种封装风格的IC四边都有引脚。 PLCC(塑料引线芯片封装):PLCC测试夹设计用于具有塑料引线芯片封装的IC。这种封装风格的IC引脚位于IC的周边,并需要与之匹配的夹子。 QFP(四边平封装):QFP测试夹用于具有四边平封装的IC。这种封装风格的IC呈正方形或长方形,四边都有引脚。 SOIC(小外延集成电路):SOIC测试夹设计用于具有小外延集成电路封装的IC。这种封装风格的IC通常有两边有引脚。 SSOP(缩小外延封装):SSOP测试夹用于具有缩小外延封装的IC。与SOIC相比,这种封装风格的IC尺寸更小,有两边有引脚。 引脚数指的是IC封装上的引脚或插针总数。测试夹提供不同的配置以适配各种IC尺寸,从8个位置(1 x 8或2 x 4)到具有最多240个位置(17 x 17)的大封装。 总之,IC芯片的测试夹可在IC芯片和测量设备之间提供临时电气连接。这些夹子采用多个接触点和弹簧装置设计,确保可靠而安全的连接。它们支持DIP、LCC、PLCC、QFP、SOIC和SSOP等各种IC封装类型,引脚数从8到240不等。这些测试夹是在电子电路中测试和故障排除IC的宝贵工具。