Edge-Grip™, C81 Series, IC Sockets

Results:
9
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Contact Material - Mating
Features
Pitch - Mating
Results remaining9
Applied Filters:
Edge-Grip™, C81
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
C8114-04
CONN IC DIP SOCKET 14POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
14 (2 x 7)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
C8122-04
CONN IC DIP SOCKET 22POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
22 (2 x 11)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.4" (10.16mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
C8128-04
CONN IC DIP SOCKET 28POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
28 (2 x 14)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
C8108-04
CONN IC DIP SOCKET 8POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (2 x 4)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
C8116-04
CONN IC DIP SOCKET 16POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
16 (2 x 8)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
C8120-04
CONN IC DIP SOCKET 20POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
20 (2 x 10)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
C8124-04
CONN IC DIP SOCKET 24POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
24 (2 x 12)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
C8140-04
CONN IC DIP SOCKET 40POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.6" (15.24mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
C8118-04
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
18 (2 x 9)
-55°C ~ 105°C
Edge-Grip™, C81
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.