0513 Series, IC Sockets

Results:
126
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Pitch - Mating
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Type
Contact Material - Mating
Features
Results remaining126
Applied Filters:
0513
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingContact Finish Thickness - PostContact Material - Post
16-513-10T
CONN SOCKET SIP 16POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
16 (1 x 16)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
6-513-10
CONN SOCKET SIP 6POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
6 (1 x 6)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
01-0513-11H
CONN SOCKET SIP 1POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Through Hole
Solder
-
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
1 (1 x 1)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
03-0513-11
CONN SOCKET SIP 3POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
3 (1 x 3)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
05-0513-10
CONN SOCKET SIP 5POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
5 (1 x 5)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
23-0513-11
CONN SOCKET SIP 23POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
23 (1 x 23)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
24-0513-11
CONN SOCKET SIP 24POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
24 (1 x 24)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
22-0513-11H
CONN SOCKET SIP 22POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
22 (1 x 22)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
01-0513-10
CONN SOCKET SIP 1POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Through Hole
Solder
-
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
1 (1 x 1)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
03-0513-10T
CONN SOCKET SIP 3POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
3 (1 x 3)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
03-0513-10
CONN SOCKET SIP 3POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
3 (1 x 3)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
02-0513-10
CONN SOCKET SIP 2POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
2 (1 x 2)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
02-0513-11H
CONN SOCKET SIP 2POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
2 (1 x 2)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
04-0513-10
CONN SOCKET SIP 4POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
4 (1 x 4)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
03-0513-10H
CONN SOCKET SIP 3POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
3 (1 x 3)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
08-0513-10
CONN SOCKET SIP 8POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (1 x 8)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
04-0513-10H
CONN SOCKET SIP 4POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
4 (1 x 4)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
08-0513-10T
CONN SOCKET SIP 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
8 (1 x 8)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
10-0513-10T
CONN SOCKET SIP 10POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
10 (1 x 10)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
15-0513-10
CONN SOCKET SIP 15POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
15 (1 x 15)
0513
SIP
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.