XR2 Series, IC Sockets

Results:
51
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Type
Features
Mounting Type
Contact Finish - Mating
Contact Material - Post
Termination
Contact Finish - Post
Operating Temperature
Housing Material
Pitch - Post
Contact Material - Mating
Pitch - Mating
Results remaining51
Applied Filters:
XR2
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
XR2A-0811-N
CONN IC DIP SOCKET 8POS GOLD
1+
$1.2676
5+
$1.1972
10+
$1.1268
Quantity
3 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Beryllium Copper
XR2D-2401-N
CONN IC DIP SOCKET 24POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Carrier
29.5µin (0.75µm)
Beryllium Copper
XR2C2611N
CONN SOCKET SIP 26POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Threaded
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
26 (1 x 26)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
10.0µin (0.25µm)
Beryllium Copper
-
10.0µin (0.25µm)
Brass
XR2C-1511-N
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
15 (1 x 15)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Beryllium Copper
XR2H-1611-N
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
Zig-Zag
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Beryllium Copper
XR2A-2001-N
CONN IC DIP SOCKET 20POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
20 (2 x 10)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Beryllium Copper
XR2C-2000-HSG
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
-
-
Solder
0.100" (2.54mm)
-
-55°C ~ 125°C
20 (1 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
Housing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
XR2E-3205
CONN SOCKET SIP 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
-
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
-
Beryllium Copper
-
-
Beryllium Copper
XR2D-4001-N
CONN IC DIP SOCKET 40POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Carrier
29.5µin (0.75µm)
Beryllium Copper
XR2A-2815
CONN IC DIP SOCKET 28POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Beryllium Copper
XR2E-3204
CONN SOCKET SIP 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
XR2C-3200-HSG
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
-
Through Hole
Wire Wrap
0.100" (2.54mm)
-
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
Housing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
XR2E-3201-N
CONN SOCKET SIP 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
29.5µin (0.75µm)
Beryllium Copper
Carrier
29.5µin (0.75µm)
Beryllium Copper
XR2A0815
CONN IC DIP SOCKET 8POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
XR2C-3205
CONN SOCKET SIP 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
XR2A-4011-N
CONN IC DIP SOCKET 40POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Beryllium Copper
XR2C3215
CONN SOCKET SIP 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Threaded
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
10.0µin (0.25µm)
Beryllium Copper
-
10.0µin (0.25µm)
Brass
XR2T2421N
CONN IC DIP SOCKET 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Threaded
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.4" (10.16mm) Row Spacing
Flash
Beryllium Copper
Open Frame
Flash
Brass
XR2T2401N
CONN IC DIP SOCKET 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Threaded
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.4" (10.16mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Open Frame
29.5µin (0.75µm)
Brass
XR2T2411N
CONN IC DIP SOCKET 24POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Threaded
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.4" (10.16mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.