SIP1x Series, IC Sockets

Results:
90
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Operating Temperature
Contact Material - Post
Housing Material
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Type
Features
Contact Material - Mating
Pitch - Mating
Results remaining90
Applied Filters:
SIP1x
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
SIP1X32-014BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (1 x 32)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X20-041BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X20-001BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X20-011BLF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X27-001BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
27 (1 x 27)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X08-014BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
8 (1 x 8)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X13-011BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
13 (1 x 13)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X21-011BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
21 (1 x 21)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X15-014BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
15 (1 x 15)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X14-011BLF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X06-014BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
6 (1 x 6)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X04-014BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
4 (1 x 4)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X04-011BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
4 (1 x 4)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X06-001BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
6 (1 x 6)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X05-011BLF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
5 (1 x 5)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X07-011BLF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
7 (1 x 7)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X06-011BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
6 (1 x 6)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X07-014BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
7 (1 x 7)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X08-011BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
8 (1 x 8)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X05-014BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
5 (1 x 5)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.