4800 Series, IC Sockets

Results:
26
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Type
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Termination
Mounting Type
Pitch - Post
Contact Finish - Post
Contact Material - Mating
Features
Pitch - Mating
Results remaining26
Applied Filters:
4800
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
4828-6004-CP
CONN IC DIP SOCKET 28POS TIN
1+
$2.1803
5+
$2.0592
10+
$1.9380
Quantity
3,740 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
28 (2 x 14)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4816-3004-CP
CONN IC DIP SOCKET 16POS TIN
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
16 (2 x 8)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4818-3000-CP
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
18 (2 x 9)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4848-6000-CP
CONN IC DIP SOCKET 48POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
48 (2 x 24)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4842-6000-CP
CONN IC DIP SOCKET 42POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
42 (2 x 21)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
135.0µin (3.43µm)
Phosphor Bronze
Open Frame
135.0µin (3.43µm)
Phosphor Bronze
4840-6000-CP
CONN IC DIP SOCKET 40POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
40 (2 x 20)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4824-6004-CP
CONN IC DIP SOCKET 24POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
24 (2 x 12)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4824-6000-CP
CONN IC DIP SOCKET 24POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
24 (2 x 12)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4818-3004-CP
CONN IC DIP SOCKET 18POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
18 (2 x 9)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4820-3000-CP
CONN IC DIP SOCKET 20POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
20 (2 x 10)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4828-3000-CP
CONN IC DIP SOCKET 28POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
28 (2 x 14)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4816-3000-CP
CONN IC DIP SOCKET 16POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
16 (2 x 8)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4814-3004-CP
CONN IC DIP SOCKET 14POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
14 (2 x 7)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4814-3000-CP
CONN IC DIP SOCKET 14POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
14 (2 x 7)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4808-3004-CP
CONN IC DIP SOCKET 8POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
8 (2 x 4)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4832-6000-CP
CONN IC DIP SOCKET 32POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
32 (2 x 16)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4820-3004-CP
CONN IC DIP SOCKET 20POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
20 (2 x 10)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4808-3000-CP
CONN IC DIP SOCKET 8POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
8 (2 x 4)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
4842-6004-CP
CONN IC DIP SOCKET 42POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
42 (2 x 21)
Polyester, Glass Filled
4800
DIP, 0.6" (15.24mm) Row Spacing
135.0µin (3.43µm)
Phosphor Bronze
Open Frame
135.0µin (3.43µm)
Phosphor Bronze
4824-3004-CP
CONN IC DIP SOCKET 24POS TIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
24 (2 x 12)
Polyester, Glass Filled
4800
DIP, 0.3" (7.62mm) Row Spacing
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.