511 Series, IC Sockets

Results:
1,237
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Contact Finish - Mating
Features
Operating Temperature
Contact Material - Post
Housing Material
Contact Material - Mating
Termination
Mounting Type
Pitch - Post
Pitch - Mating
Results remaining1,237
Applied Filters:
511
Select
ImageProduct DetailPriceAvailabilityECAD ModelFeaturesPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialOperating TemperatureNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingContact Finish Thickness - PostContact Material - Post
18-0511-11
CONN SOCKET SIP 18POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
18 (1 x 18)
511
SIP
10.0µin (0.25µm)
Phosphor Bronze
10.0µin (0.25µm)
Phosphor Bronze
511-91-145-13-041002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
145 (13 x 13)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-145-15-002001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
145 (15 x 15)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-145-15-002002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
145 (15 x 15)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-145-15-081002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
145 (15 x 15)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-145-17-001002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
145 (17 x 17)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-145-17-001003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
145 (17 x 17)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-149-15-061002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
149 (15 x 15)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-155-16-003002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
155 (16 x 16)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-155-16-003003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
155 (16 x 16)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-155-18-121001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
155 (18 x 18)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-156-15-061001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
156 (15 x 15)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-159-16-105002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
159 (16 x 16)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-168-17-101001
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
168 (17 x 17)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-168-17-101002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
168 (17 x 17)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-169-13-000003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Closed Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
169 (13 x 13)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-169-17-101002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
169 (17 x 17)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-173-16-005002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
173 (16 x 16)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-175-16-005002
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
175 (16 x 16)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy
511-91-175-16-005003
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Open Frame
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
175 (16 x 16)
511
PGA
10.0µin (0.25µm)
Beryllium Copper
200.0µin (5.08µm)
Brass Alloy

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.