6556 Series, IC Sockets

Results:
64
Manufacturer
Series
Number of Positions or Pins (Grid)
Termination
Operating Temperature
Contact Finish Thickness - Post
Contact Finish - Post
Contact Finish - Mating
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Mounting Type
Pitch - Post
Type
Features
Contact Material - Mating
Pitch - Mating
Results remaining64
Applied Filters:
6556
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
24-6556-11
CONN IC DIP SOCKET 24POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
24 (2 x 12)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
42-6556-10
CONN IC DIP SOCKET 42POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
42 (2 x 21)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
40-6556-10
CONN IC DIP SOCKET 40POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
40 (2 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
28-6556-10
CONN IC DIP SOCKET 28POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
40-6556-40
CONN IC DIP SOCKET 40POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder Cup
0.100" (2.54mm)
Tin
40 (2 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
36-6556-41
CONN IC DIP SOCKET 36POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder Cup
0.100" (2.54mm)
Gold
36 (2 x 18)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
36-6556-40
CONN IC DIP SOCKET 36POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder Cup
0.100" (2.54mm)
Tin
36 (2 x 18)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
32-6556-41
CONN IC DIP SOCKET 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder Cup
0.100" (2.54mm)
Gold
32 (2 x 16)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
44-6556-41
CONN IC DIP SOCKET 44POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder Cup
0.100" (2.54mm)
Gold
44 (2 x 22)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
28-6556-40
CONN IC DIP SOCKET 28POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder Cup
0.100" (2.54mm)
Tin
28 (2 x 14)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
40-6556-31
UNIV TEST SOCKET RECEPT 6556
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Quantity
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PCB Symbol, Footprint & 3D Model
150°C
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
40 (2 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
48-6556-10
CONN IC DIP SOCKET 48POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
48 (2 x 24)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
28-6556-31
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
28 (2 x 14)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
28-6556-21
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
28 (2 x 14)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
42-6556-20
CONN IC DIP SOCKET 42POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
42 (2 x 21)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
42-6556-30
CONN IC DIP SOCKET 42POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
42 (2 x 21)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
42-6556-21
CONN IC DIP SOCKET 42POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
42 (2 x 21)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
42-6556-31
CONN IC DIP SOCKET 42POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
42 (2 x 21)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
24-6556-41
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder Cup
0.100" (2.54mm)
Gold
24 (2 x 12)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
28-6556-11
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
28 (2 x 14)
Polyphenylene Sulfide (PPS), Glass Filled
6556
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.