550 Series, IC Sockets

Results:
104
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Housing Material
Contact Finish Thickness - Mating
Pitch - Post
Contact Finish Thickness - Post
Type
Contact Finish - Post
Features
Contact Material - Mating
Pitch - Mating
Operating Temperature
Contact Material - Post
Termination
Mounting Type
Results remaining104
Applied Filters:
550
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureSeriesTypeNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
550-80-191-18-091101
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
550
PGA
191 (18 x 18)
-
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-192M16-001166
BGA PIN ADAPTER 1.27MM SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
550
BGA
192 (16 x 16)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
550-10-144-15-081101
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
144 (15 x 15)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-144-12-000101
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
144 (12 x 12)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-241-18-071101
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
241 (18 x 18)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-145-15-001101
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
145 (15 x 15)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-480M29-001152
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Quantity
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PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
550
BGA
480 (29 x 29)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
550-10-500M30-001152
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Quantity
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PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
550
BGA
500 (30 x 30)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
550-10-504M29-001152
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Quantity
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PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
550
BGA
504 (29 x 29)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
550-10-576M30-001152
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
550
BGA
576 (30 x 30)
10.0µin (0.25µm)
Brass
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
550-10-169-17-101101
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
169 (17 x 17)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-361-18-101135
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Quantity
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PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Tin
Through Hole
Solder
0.050" (1.27mm)
Tin
-55°C ~ 125°C
550
PGA
361 (18 x 18)
-
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-456M26-001166
BGA PIN ADAPTER 1.27MM SMD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
550
BGA
456 (26 x 26)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
550-10-478M26-131166
BGA PIN ADAPTER 1.27MM SMD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
550
BGA
478 (26 x 26)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
550-10-149-15-063101
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
149 (15 x 15)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-256M20-001166
BGA PIN ADAPTER 1.27MM SMD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
-55°C ~ 125°C
550
BGA
256 (20 x 20)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Brass
FR4 Epoxy Glass
550-10-124-13-041101
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
124 (13 x 13)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-296-19-131135
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
550
PGA
296 (19 x 19)
-
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-121-13-061101
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
121 (13 x 13)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-132-13-041101
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
550
PGA
132 (13 x 13)
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.