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Manufacturer:
CUI DevicesDescription:
HEAT SINK TO-263 COPPER
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TYPE | DESCRIPTION |
---|---|
Manufacturer | CUI Devices |
Series | HSS |
Material | Copper |
Length | 0.591" (15.00mm) |
Shape | Rectangular, Fins |
Type | Top Mount |
Width | 1.020" (25.91mm) |
Package Cooled | TO-263 (D²Pak) |
Power Dissipation @ Temperature Rise | 2.1W @ 75°C |
Thermal Resistance @ Forced Air Flow | 8.15°C/W @ 200 LFM |
Thermal Resistance @ Natural | 35.71°C/W |
Fin Height | 0.375" (9.52mm) |
Material Finish | Tin |
HSS-C2591-SMT-TR - From Manufacturer: CUI Devices, it is an HEAT SINK TO-263 COPPER, part of Fans, Thermal Management, Thermal, Heat Sinks. HSS-C2591-SMT-TR stock status: need to confirm with us, contact us! Quick Reply.