ICE Tower Series, Heat Sinks

Results:
5
Manufacturer
Series
Package Cooled
Shape
Attachment Method
Material
Fin Height
Type
Thermal Resistance @ Forced Air Flow
Length
Thermal Resistance @ Natural
Material Finish
Width
Diameter
Power Dissipation @ Temperature Rise
Results remaining5
Applied Filters:
ICE Tower
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ImageProduct DetailPriceAvailabilityECAD ModelLengthShapeMaterialWidthDiameterSeriesTypePackage CooledAttachment MethodFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
114992082
BLACK WARRIOR ICE TOWER CPU COOL
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Quantity
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PCB Symbol, Footprint & 3D Model
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Rectangular
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ICE Tower
Board Level
Raspberry Pi 3, 4, B+
Bolt On and Thermal Tape, Adhesive (Included)
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114992049
ICE TOWER CPU COOLING FAN FOR NV
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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ICE Tower
Board Level
Nvidia Jetson Nano
Clip
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-
-
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114991948
ICE TOWER CPU COOLING FAN FOR RA
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Quantity
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PCB Symbol, Footprint & 3D Model
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Rectangular
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-
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ICE Tower
Board Level
Raspberry Pi 3, 4, B+
Bolt On and Thermal Tape, Adhesive (Included)
-
-
-
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FIT0713
COLORFUL ICE TOWER COOLING FAN F
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Quantity
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PCB Symbol, Footprint & 3D Model
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Rectangular
-
-
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ICE Tower
Board Level
Raspberry Pi 3B, 3B+, 4B
Bolt On and Thermal Tape, Adhesive (Included)
-
-
-
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114992048
BLINK BLINK ICE TOWER CPU COOLIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
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ICE Tower
Board Level
Raspberry Pi 3B, 3B+, 4B
Bolt On and Thermal Tape, Adhesive (Included)
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About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.