maxiGRIP, maxiFLOW Series, Heat Sinks

Results:
113
Filters
Applied Filters:
maxiGRIP, maxiFLOW
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesMaterialWidthDiameterLengthAttachment MethodTypePackage CooledShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
ATS-50290B-C0-R0
HEAT SINK 29X29 X 7.5MM W/O TIM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.142" (29.00mm)
-
1.142" (29.00mm)
Clip
Top Mount
BGA
Square, Angled Fins
0.295" (7.50mm)
-
7.40°C/W @ 200 LFM
-
Blue Anodized
ATS-50270P-C1-R0
HEAT SINK 27MM X 27MM X 17.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.063" (27.00mm)
-
1.063" (27.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.689" (17.50mm)
-
3.70°C/W @ 200 LFM
-
Blue Anodized
ATS-50190B-C1-R0
HEAT SINK 19MM X 19MM X 7.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
0.748" (19.00mm)
-
0.748" (19.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.295" (7.50mm)
-
16.50°C/W @ 200 LFM
-
Blue Anodized
ATS-51190D-C1-R0
HEAT SINK 19MM X 19MM X 9.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
0.748" (19.00mm)
-
0.748" (19.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.374" (9.50mm)
-
16.70°C/W @ 200 LFM
-
Black Anodized
ATS-50270B-C1-R0
HEAT SINK 27MM X 27MM X 7.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.063" (27.00mm)
-
1.063" (27.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.295" (7.50mm)
-
7.90°C/W @ 200 LFM
-
Blue Anodized
ATS-51170K-C1-R0
HEAT SINK 17MM X 17MM X 14.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
0.669" (17.00mm)
-
0.669" (17.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.571" (14.50mm)
-
10.90°C/W @ 200 LFM
-
Black Anodized
ATS-50230G-C1-R0
HEAT SINK 23MM X 23MM X 12.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
0.906" (23.01mm)
-
0.900" (23.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.492" (12.50mm)
-
6.70°C/W @ 200 LFM
-
Blue Anodized
ATS-50270G-C1-R0
HEAT SINK 27MM X 27MM X 12.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.063" (27.00mm)
-
1.063" (27.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.492" (12.50mm)
-
4.80°C/W @ 200 LFM
-
Blue Anodized
ATS-51350D-C1-R0
HEAT SINK 35MM X 35MM X 9.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.378" (35.00mm)
-
1.378" (35.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.374" (9.50mm)
-
5.30°C/W @ 200 LFM
-
Black Anodized
ATS-50310G-C1-R0
HEAT SINK 31MM X 31MM X 12.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.220" (30.99mm)
-
1.220" (30.99mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.492" (12.50mm)
-
4.30°C/W @ 200 LFM
-
Blue Anodized
ATS-50190P-C1-R0
HEAT SINK 19MM X 19MM X 17.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
0.748" (19.00mm)
-
0.748" (19.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.689" (17.50mm)
-
7.70°C/W @ 200 LFM
-
Blue Anodized
ATS-51290K-C1-R0
HEAT SINK 29MM X 29MM X 14.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.142" (29.00mm)
-
1.142" (29.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.571" (14.50mm)
-
4.50°C/W @ 200 LFM
-
Black Anodized
ATS-51350K-C1-R0
HEAT SINK 35MM X 35MM X 14.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.378" (35.00mm)
-
1.378" (35.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.571" (14.50mm)
-
2.90°C/W @ 200 LFM
-
Black Anodized
ATS-50310P-C1-R0
HEAT SINK 31MM X 31MM X 17.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.220" (30.99mm)
-
1.220" (30.99mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.689" (17.50mm)
-
3.30°C/W @ 200 LFM
-
Blue Anodized
ATS-51270R-C1-R0
HEAT SINK 27MM X 27MM X 19.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.063" (27.00mm)
-
1.063" (27.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.768" (19.50mm)
-
3.60°C/W @ 200 LFM
-
Black Anodized
ATS-50290B-C4-R0
HEATSINK 29X29X7.5MM CUSTOM TIM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.142" (29.00mm)
-
1.142" (29.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.295" (7.50mm)
-
7.40°C/W @ 200 LFM
-
Blue Anodized
ATS-50400P-C3-R0
HEATSINK 40X40X17.5MM W/PHS CHG
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.575" (40.00mm)
-
1.575" (40.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.689" (17.50mm)
-
2.00°C/W @ 200 LFM
-
Blue Anodized
ATS-50400G-C3-R0
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
1.575" (40.00mm)
-
1.575" (40.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.492" (12.50mm)
-
2.60°C/W @ 200 LFM
-
Blue Anodized
ATS-50250B-C1-R0
HEAT SINK 25MM X 25MM X 7.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
0.984" (25.00mm)
-
0.984" (25.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.295" (7.50mm)
-
8.60°C/W @ 200 LFM
-
Blue Anodized
ATS-51210D-C1-R0
HEAT SINK 21MM X 21MM X 9.5MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
maxiGRIP, maxiFLOW
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
Clip, Thermal Material
Top Mount
BGA
Square, Angled Fins
0.374" (9.50mm)
-
12.00°C/W @ 200 LFM
-
Black Anodized

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.