FHS Series, Heat Sinks

Results:
15
Manufacturer
Series
Thermal Resistance @ Natural
Package Cooled
Fin Height
Length
Shape
Width
Material
Diameter
Attachment Method
Type
Thermal Resistance @ Forced Air Flow
Material Finish
Power Dissipation @ Temperature Rise
Results remaining15
Applied Filters:
FHS
Select
ImageProduct DetailPriceAvailabilityECAD ModelMaterialSeriesDiameterWidthLengthTypePackage CooledAttachment MethodShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
FHS-A7015S61
77X68X38MM, AMD AM2/AM2+/AM3/AM3
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
FHS
-
2.677" (68.00mm)
3.031" (77.00mm)
Board Level
AMD CPU Cooler
Bolt On and Clip
Rectangular, Fins
1.929" (49.00mm)
-
-
0.31°C/W
-
FHS-A6025B00
FAN CPU COOLER 90X64MM 12VDC
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum, Plastic
FHS
-
3.543" (90.00mm)
3.543" (90.00mm)
Board Level
Intel 1366 CPU Cooler
Bolt On
Square, Fins
2.516" (63.90mm)
-
-
0.31°C/W
-
FHS-A9025S19
FAN CPU COOLER 90X19.1MM 12VDC
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Aluminum, Copper, Plastic
FHS
3.657" (92.90mm) OD
-
-
Board Level
Intel LGA1156 CPU Cooler
Bolt On
Round
1.811" (46.00mm)
-
-
0.36°C/W
-
FHS-A9025S20
FAN CPU COOLER 90X19.1MM 12VDC
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum, Plastic
FHS
3.657" (92.90mm) OD
-
-
Board Level
Intel LGA1156 CPU Cooler
Bolt On
Round
1.811" (46.00mm)
-
-
0.37°C/W
-
FHS-A6025B02A
FAN CPU COOLER 91.5X91.5MM 12VDC
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum, Copper, Plastic
FHS
-
3.602" (91.50mm)
3.602" (91.50mm)
Board Level
Intel LGA2011 Cooler
Bolt On
Square, Fins
2.519" (64.00mm)
-
-
0.18°C/W
-
FHS-K8020S00
FAN CPU COOLER 80X22MM 12VDC
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum, Copper, Plastic
FHS
-
3.481" (88.42mm)
7.843" (199.21mm)
Board Level
Intel LGA1155 CPU Cooler
Bolt On
Rectangular
1.035" (26.30mm)
-
-
0.37°C/W
-
FHS-A9025S18
FAN CPU COOLER 90X19.1MM 12VDC
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum, Copper, Plastic
FHS
3.543" (90.00mm) OD
-
-
Board Level
Intel LGA775 CPU Cooler
Bolt On
Round
1.811" (46.00mm)
-
-
0.54°C/W
-
FHS-A9025S17
FAN CPU COOLER 90X19.1MM 12VDC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum, Plastic
FHS
3.543" (90.00mm) OD
-
-
Board Level
Intel LGA775 CPU Cooler
Bolt On
Round
1.811" (46.00mm)
-
-
0.64°C/W
-
FHS-A9015S00
FAN CPU COOLER 90X30MM 12VDC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum, Plastic
FHS
3.543" (90.00mm) OD
-
-
Board Level
Intel LGA1156 & LGA1155 Cooler
Bolt On
Round
1.181" (30.00mm)
-
-
0.52°C/W
-
FHS-A9025S16
FAN CPU COOLER 90X19.1MM 12VDC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum, Plastic
FHS
3.543" (90.00mm) OD
-
-
Board Level
Intel LGA775 CPU Cooler
Bolt On
Round
1.811" (46.00mm)
-
-
0.54°C/W
-
FHS-A9020S01
FAN CPU COOLER 100X40MM 12VDC
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum, Copper, Plastic
FHS
4.094" (104.00mm) OD
-
-
Board Level
Intel LGA1366 CPU Cooler
Bolt On
Round
2.480" (63.00mm)
-
-
0.25°C/W
-
FHS-A7015B62
77X68X48MM, AMD AM2/AM2+/AM3/AM3
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
FHS
-
2.677" (68.00mm)
3.031" (77.00mm)
Board Level
AMD APU and CPU Coolers
Bolt On and Clip
Rectangular, Fins
1.496" (38.00mm)
-
-
0.43°C/W
-
FHS-A6025B01
FAN CPU COOLER 90X64MM 12VDC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum, Copper, Plastic
FHS
-
3.543" (90.00mm)
3.543" (90.00mm)
Board Level
Intel 1366 CPU Cooler
Bolt On
Square, Fins
2.519" (64.00mm)
-
-
0.20°C/W
-
FHS-A9025S32
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
FHS
-
-
-
-
-
-
-
-
-
-
-
-
FHS-A9025S33
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
FHS
-
-
-
-
-
-
-
-
-
-
-
-

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.